Search Results - "TaeJe Cho"
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Korean consumers’ awareness of the risks of chemicals in daily consumer products
Published in Environmental sciences Europe (21-12-2019)“…Background Recent tragic accidents due to the use of humidifier disinfectants have caused severe distrust and anxiety over chemicals in consumer products in…”
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Journal Article -
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Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Published in Microelectronics and reliability (2008)“…Growth behavior of tin whiskers from pure tin and tin–bismuth plated leadframe (LF) packages for elevated temperature and high humidity storages and during…”
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Journal Article -
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Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Published in Microelectronics and reliability (01-12-2007)“…Growth behavior of tin whiskers from pure tin and tin-bismuth plated leadframe (LF) packages for elevated temperature and high humidity storages and during…”
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Journal Article -
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Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01-01-2021)“…The demand for high density and high performance package is increasing as AI and server market continues to grow. The demand for low cost packaging solution is…”
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Conference Proceeding -
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Fine pitch chip interconnection technology for 3D integration
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01-01-2010)“…3D-IC packaging using through silicon via technology has been extensively developed to meet small form factor and low power consumption for next generation…”
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Conference Proceeding
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Methodology for accurate junction temperature estimation of SIP(System in Package)
Published in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) (2004)“…As the mobile products have been developed, lots of devices of various functions should be packaged into the limited space. Therefore, as many as possible…”
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Conference Proceeding -
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Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer Platform
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…As mobile hand-held devices including mobile phone are required to provide multi-media services more and more, it is necessary that the various hardware…”
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Conference Proceeding -
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Development of multi stack package with high drop reliability by experimental and numerical methods
Published in 56th Electronic Components and Technology Conference 2006 (2006)“…Board level drop reliability of MSP (multi stack package) composed of a logic chipset package at bottom and an MCP (multi chip package) at top was…”
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Conference Proceeding -
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Thermal Characterization of Multi Stack Packages Using Linear Superposition Method
Published in 2006 1st Electronic Systemintegration Technology Conference (01-09-2006)“…As the mobile products have been developed, many devices of various functions should be packaged into the limited space. Therefore, stacking multi-packages is…”
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Conference Proceeding -
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Samung Fan-out Panel Level Package Solutions
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01-03-2019)“…As the industry moves Beyond Moore, there has been much efforts for the next-generation of packaging, among which Fan-out wafer-level-package is getting…”
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Conference Proceeding