Search Results - "Tackhwi Lee"
-
1
Reduced Gate-Leakage Current and Charge Trapping Characteristics of Dysprosium-Incorporated \hbox Gate-Oxide n-MOS Devices
Published in IEEE transactions on electron devices (01-02-2011)“…The higher effective barrier height of Dy 2 O 3 , which is around 2.32 eV calculated from the Fowler-Nordheim plot, accounts for the reduced leakage current in…”
Get full text
Journal Article -
2
Investigation of transient relaxation under static and dynamic stress in Hf-based gate oxides
Published in IEEE transactions on electron devices (01-05-2006)“…Transient relaxation, which has been addressed as an undesirable issue in high-k alternate gate dielectrics, has been studied systematically. In Hf-based…”
Get full text
Journal Article -
3
Hafnium Titanate bilayer structure multimetal dielectric nMOSCAPs
Published in IEEE electron device letters (01-04-2006)“…A novel approach of fabricating laminated TiO/sub 2//HfO/sub 2/ bilayer multimetal oxide dielectric has been developed for high-performance CMOS applications…”
Get full text
Journal Article -
4
Systematic analysis of silicon oxynitride interfacial layer and its effects on electrical characteristics of high-k HfO2 transistor
Published in Applied physics letters (10-04-2006)“…High-k hafnium oxide dielectric metal-oxide-semiconductor field-effect transistors with several physical thicknesses of silicon oxynitride interfacial layers…”
Get full text
Journal Article -
5
Structural advantage for the EOT scaling and improved electron channel mobility by incorporating dysprosium oxide (Dy/sub 2/O/sub 3/) into HfO/sub 2/ n-MOSFETs
Published in IEEE electron device letters (01-08-2006)“…A structural approach of fabricating laminated Dy 2 O 3 -incorporated HfO 2 multimetal oxide dielectric has been developed for high-performance CMOS…”
Get full text
Journal Article -
6
Metal gate-HfO/sub 2/ MOS structures on GaAs substrate with and without Si interlayer
Published in IEEE electron device letters (01-03-2006)“…In this letter, we studied the effects of post-deposition anneal (PDA) time and Si interface control layer (ICL) on the electrical characteristics of the MOS…”
Get full text
Journal Article -
7
Aggressively scaled ultra thin undoped HfO/sub 2/ gate dielectric (EOT<0.7 nm) with TaN gate electrode using engineered interface layer
Published in IEEE electron device letters (01-07-2005)“…The ultrathin HfO/sub 2/ gate dielectric (EOT<0.7 nm) has been achieved by using a novel "oxygen-scavenging effect" technique without incorporation of nitrogen…”
Get full text
Journal Article -
8
Reduced Gate-Leakage Current and Charge Trapping Characteristics of Dysprosium-Incorporated [Formula Omitted] Gate-Oxide n-MOS Devices
Published in IEEE transactions on electron devices (01-02-2011)“…The higher effective barrier height of [Formula Omitted], which is around 2.32 eV calculated from the Fowler-Nordheim plot, accounts for the reduced leakage…”
Get full text
Journal Article -
9
Reduced Gate-Leakage Current and Charge Trapping Characteristics of Dysprosium-Incorporated hbox HfO 2 Gate-Oxide n-MOS Devices
Published in IEEE transactions on electron devices (01-02-2011)“…The higher effective barrier height of hbox Dy 2 hbox O 3 , which is around 2.32 eV calculated from the Fowler-Nordheim plot, accounts for the reduced leakage…”
Get full text
Journal Article -
10
-
11
Metal gate-HfO2 metal-oxide-semiconductor capacitors on n-GaAs substrate with silicon/germanium interfacial passivation layers
Published in Applied physics letters (27-11-2006)“…In this letter, the authors present the capacitance-voltage and current-voltage characteristics of TaN∕HfO2∕n-GaAs metal-oxide-semiconductor capacitors with…”
Get full text
Journal Article -
12
Space Program Scheme for 3-D NAND Flash Memory Specialized for the TLC Design
Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)“…A new space program (PGM) scheme is proposed to achieve reliable triple-level-cell (TLC) 3-D NAND flash memory. Considering the lateral diffusion issue of…”
Get full text
Conference Proceeding -
13
Ultrathin HfO2 (equivalent oxide thickness=1.1nm) metal-oxide-semiconductor capacitors on n-GaAs substrate with germanium passivation
Published in Applied physics letters (19-06-2006)“…We present the capacitance-voltage characteristics of TaN∕HfO2∕n-GaAs metaloxide-semiconductor capacitors, with an equivalent oxide thickness (EOT) of 10.9Å,…”
Get full text
Journal Article -
14
Neuromorphic Technology Based on Charge Storage Memory Devices
Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)“…Four synaptic devices are introduced for spiking neural networks (SNNs) and deep neural networks (DNNs). Unsupervised learning is successfully demonstrated by…”
Get full text
Conference Proceeding -
15
Metal Gate-HfO2 MOS structures on GaAs substrate with and without Si interlayer
Published in IEEE electron device letters (01-03-2006)Get full text
Journal Article -
16
-
17
Metal gate- Hf O 2 metal-oxide-semiconductor capacitors on n - Ga As substrate with silicon/germanium interfacial passivation layers
Published in Applied physics letters (27-11-2006)“…In this letter, the authors present the capacitance-voltage and current-voltage characteristics of Ta N ∕ Hf O 2 ∕ n - Ga As metal-oxide-semiconductor…”
Get full text
Journal Article -
18
Ultrathin Hf O 2 (equivalent oxide thickness = 1.1 nm )metal-oxide-semiconductor capacitors on n - Ga As substrate with germanium passivation
Published in Applied physics letters (22-06-2006)“…We present the capacitance-voltage characteristics of Ta N ∕ Hf O 2 ∕ n - Ga As metal oxide-semiconductor capacitors, with an equivalent oxide thickness (EOT)…”
Get full text
Journal Article -
19
Aggressively scaled ultrathin undoped HfO2 gate dielectric (EOT < 0.7 nm) with TaN gate electrode using engineered interface layer
Published in IEEE electron device letters (01-07-2005)Get full text
Journal Article -
20
Systematic analysis of silicon oxynitride interfacial layerand its effects on electrical characteristics of high- k Hf O 2 transistor
Published in Applied physics letters (13-04-2006)“…High- k hafnium oxide dielectric metal-oxide-semiconductor field-effect transistors with several physical thicknesses of silicon oxynitride interfacial layers…”
Get full text
Journal Article