Search Results - "Tabasky, M."

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  1. 1

    Sharing perspectives on feedback: a combined resident-faculty workshop by Kim, Bo, Rajagopalan, Aishwarya, Tabasky, Edward M, Reddy, Sparsha S, Topor, David R

    Published in BMC medical education (22-03-2022)
    “…Feedback is essential to medical education. Although the need for effective feedback delivery is well known, more recent focus is on understanding and…”
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    Journal Article
  2. 2

    Fabrication of waveguides using low‐temperature plasma processing techniques by Bulat, E. S., Tabasky, M., Tweed, B., Herrick, C., Hankin, S., Lewis, N. J., Oblas, D., Fitzgerald, T.

    “…The proliferation of the use of light as the transfer medium in communications has brought about some unique technical challenges. Among these is the…”
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    Conference Proceeding Journal Article
  3. 3

    Silicon epitaxial growth on Si-TaSi2 eutectic composite substrates by LEVINSON, M, TABASKY, M, SUNG, C, HAMILL, G, MATTHIESEN, D. H, OSTREICHER, K, DITCHEK, B. M

    Published in Applied physics letters (17-06-1991)
    “…Epitaxial layers of Si were grown by atmospheric chemical vapor deposition on two-phase, Si-TaSi2 eutectic composite substrates. Characterization by scanning…”
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    Journal Article
  4. 4

    Direct silicidation of Co on Si by rapid thermal annealing by Tabasky, M., Bulat, E.S., Ditchek, B.M., Sullivan, M.A., Shatas, S.C.

    Published in IEEE transactions on electron devices (01-03-1987)
    “…Rapid thermal annealing is used to form cobalt silicide directly on unimplanted as well as B-, As-, and P-implanted wafers. The films are characterized by…”
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    Journal Article
  5. 5

    ARPA analog optoelectronic module program: packaging challenges for analog optoelectronic arrays by Hsu, H.P., Yap, D., Ng, W., Yen, H.W., Armiento, C., Tabasky, M., Mehr, J., Negri, A., Haugsjaa, P.

    “…This paper describes the packaging challenges associated with array-based transmitters and receivers used for analog fiber-optic links. The optoelectronic…”
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    Conference Proceeding Journal Article
  6. 6

    Fluxless die bonding for optoelectronics by Boudreau, R., Tabasky, M., Armiento, C., Bellows, A., Cataldo, V., Morrison, R., Urban, M., Sargent, R., Negri, A., Haugsjaa, P.

    “…Two new approaches are described for epi-down die bonding of diode lasers. The first approach, based on an acetic acid vapor flux, eliminates complications…”
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    Conference Proceeding
  7. 7

    Investigation of thick, low‐temperature plasma deposited silica films for waveguide fabrication by Tabasky, M., Bulat, E. S., Tweed, B., Herrick, C.

    “…Optical devices, such as directional couplers made from silica waveguides, are used to route optical signals at points where optoelectronic conversions are…”
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    Conference Proceeding Journal Article
  8. 8

    Gigabit transmitter array modules on silicon waferboard by Armiento, C.A., Negri, A.J., Tabasky, M.J., Boudreau, R.A., Rothman, M.A., Fitzgerald, T.W., Haugsjaa, P.O.

    “…Individually addressable, four-channel transmitter arrays operating at data rates of 1 Gb/s have been developed based on a hybrid optoelectronic integration…”
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    Journal Article Conference Proceeding
  9. 9

    Silicon waferboard-based single-mode optical fiber interconnects by Haugsjaa, P.O., Duchene, G.A., Mehr, J.F., Negri, A.J., Tabasky, M.J.

    “…In an extension of previous work, hybrid integration utilizing silicon waferboard platforms has been shown to be useful in building complete single-mode,…”
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    Journal Article Conference Proceeding
  10. 10

    Challenges for optoelectronic hardware in fiber-to-the home systems by Armiento, C., Melman, P., Bulat, E., Tabasky, M.

    “…Fiber-to-the-Home (FTTH) is considered to be the ultimate approach to delivering services such as video, high-speed data etc. Deployment of a FTTH network…”
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    Conference Proceeding
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