Search Results - "TAE SUNG OH"

Thermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications by Kim, Jae-Hwan, Choi, Jung-Yeol, Bae, Jae-Man, Kim, Min-Young, Oh, Tae-Sung

“…A thermoelectric thin-film device consisting of n-type Bi2Te3 and p-type Sb2Te3 thin-film legs was prepared on a glass substrate by using co-evaporation and…”
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Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications by Choi, Jung-Yeol, Oh, Tae Sung

“…For applications in smart textiles, flip-chip bonding was applied with either an anisotropic conductive adhesive (ACA) or a nonconductive adhesive (NCA) to a…”
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EMR versus gastrectomy for intramucosal gastric cancer: comparison of long-term outcomes by Choi, Kwi-Sook, MD, PhD, Jung, Hwoon-Yong, MD, PhD, AGAF, Choi, Kee Don, MD, PhD, Lee, Gin Hyug, MD, PhD, Song, Ho June, MD, PhD, Kim, Do Hoon, MD, Lee, Jeong Hoon, MD, Kim, Mi-Young, MD, Kim, Byung Sik, MD, PhD, Oh, Sung Tae, MD, PhD, Yook, Jeong Hwan, MD, PhD, Jang, Se Jin, MD, PhD, Yun, Sung-Cheol, PhD, Kim, Seon Ok, Kim, Jin-Ho, MD, PhD

“…Background Limited data exist regarding the long-term outcomes of EMR compared with gastrectomy. Objective To compare the long-term outcomes after EMR and…”
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Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding by Kim, Min-Young, Oh, Tae-Sung

“…Using electrodeposition and flip-chip bonding, a cross-plane thin film device consisting of 242 pairs of the electrodeposited n-type Bi–Te and p-type Sb–Te…”
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Pathologic Discordance of Differentiation Between Endoscopic Biopsy and Postoperative Specimen in Mucosal Gastric Adenocarcinomas by Lee, In-Seob, Park, Young-Soo, Lee, Jeong Hoon, Park, Ji Young, Kim, Hee-Sung, Kim, Beom-Su, Yook, Jeong-Hwan, Oh, Sung-Tae, Kim, Byung-Sik

“…Background Tumor differentiation is a major determinant of endoscopic resection in mucosal gastric cancers, and the treatment decision is usually based on a…”
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Population-based volume kinetics of Ringer’s lactate solution in patients undergoing open gastrectomy by Lee, Joo-Hyun, Choo, Yeong-Jin, Lee, Yong-Hun, Rhim, Jin-Ho, Lee, Soo-Han, Choi, Byung-Moon, Oh, Sung-Tae, Choi, Kyu-Taek, Noh, Gyu-Jeong

“…In order to maintain stable blood pressure and heart rate during surgery, anesthesiologists need to administer the appropriate amount of fluid with appropriate…”
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Thermoelectric properties of the bismuth–antimony–telluride and the antimony–telluride films processed by electrodeposition for micro-device applications by Lim, Su-Kyum, Kim, Min-Young, Oh, Tae-Sung

“…Thermoelectric properties of the electrodeposited bismuth–antimony–telluride (Bi–Sb–Te) and the antimony–telluride (Sb–Te) films were characterized. The…”
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Crystallization behavior and thermoelectric characteristics of the electrodeposited Sb2Te3 thin films by KIM, Min-Young, OH, Tae-Sung

“…Crystallization behavior of the electrodeposited Sb2Te3 film was characterized and the effect of the amorphous-crystalline transition on the Seebeck…”
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Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi2Te3 and Sb2Te3 Thin-Film Legs Using an Anisotropic Conductive Adhesive by Shin, Kang-Je, Oh, Tae-Sung

“…A thermoelectric thin-film device with a cross-plane configuration was fabricated by the flip-chip process using an anisotropic conductive adhesive. The Cu/Au…”
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Electrodeposition behavior and characteristics of Ni-carbon nanotube composite coatings by KIM, Sung-Kyu, OH, Tae-Sung

“…Ni-CNT （carbon nanotube） composite coatings were processed by electrodeposition and their hardness and corrosion characteristics were investigated with…”
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Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films by Kim, Min-Young, Oh, Tae-Sung

“…Thermopile sensors were processed on glass substrates by using successive electrodeposition of p-type Sb-Te and n-type Bi-Te thin films, and their…”
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Comparison of survival of surgical resection and conservative treatment in patients with gastric cancer aged 80 years or older: a single-center experience by Gong, Chung-Sik, Yook, Jeong-Hwan, Oh, Sung-Tae, Kim, Byung-Sik

“…With the increase in the average life expectancy, the elderly population continues to increase rapidly. However, no consensus has been reached on the…”
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Loss of Androgen Receptor in Aging and Oxidative Stress through Myb Protooncoprotein-regulated Reciprocal Chromatin Dynamics of p53 and Poly(ADP-ribose) Polymerase PARP-1 by Shi, Liheng, Ko, Soyoung, Kim, Soyoung, Echchgadda, Ibtissam, Oh, Tae-Sung, Song, Chung S., Chatterjee, Bandana

“…Poly(ADP-ribosyl)ation of transcription factors and coregulators, mediated by the poly(ADP-ribose) polymerase PARP-1, has been emerging as an important…”
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Typical carcinoids and neuroendocrine carcinomas of the stomach: differing clinical courses and prognoses by Kim, Beom Su, M.D, Oh, Sung Tae, M.D, Yook, Jeong Hwan, M.D, Kim, Kab Choong, M.D, Kim, Min Gyu, M.D, Jeong, Jun Won, M.D, Kim, Byung Sik, M.D

“…Abstract Background Gastric endocrine tumors are usually classified as 3 types of well-differentiated endocrine tumors (typical carcinoids or carcinoids) and…”
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Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin by Kim, Min-Young, Kim, Sung-Kyu, Oh, Tae-Sung

“…Formation of through-silicon-via (TSV) was examined by pressure infiltration of molten Sn into Si via-holes with variations of the infiltration pressure,…”
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Androgen Receptor: Structural Domains and Functional Dynamics after Ligand-Receptor Interaction by ROY, ARUN K., TYAGI, RAKESH K., SONG, CHUNG S., LAVROVSKY, YAN, AHN, SOON C., OH, TAE-SUNG, CHATTERJEE, BANDANA

“…: Androgens are C‐19 steroids secreted primarily from the testes and adrenals that play a critical role in reproduction. Reproductive functions of androgens…”
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Flip-Chip Process Using Interlocking-Bump Joints by Oh, Tae-Sung, Lee, Kwang-Yong, Won, Hye-Jin

“…A new flip-chip process using interlocking-bump joints, formed by inserting Cu bumps into Sn bumps, was investigated. Severe plastic deformation of Sn bumps…”
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Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n-Bi2Te3 and p-Sb2Te3 Thin-Film Legs by Kim, Min-Young, Oh, Tae-Sung

“…A thermoelectric thin-film device of the cross-plane configuration was fabricated by flip-chip bonding of the top electrodes to 242 pairs of electrodeposited n…”
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Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates by Park, Donghyun, Oh, Tae Sung

“…To compare the flip-chip bonding characteristics on rigid, flexible, and stretchable substrates, the contact-resistance and microstructure of the flip-chip…”
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Stretchable Characteristics of Thin Au Film on Polydimethylsiloxane Substrate with Parylene Intermediate Layer for Stretchable Electronic Packaging by Park, Donghyun, Shin, Soo Jin, Oh, Tae Sung

“…Thin Au films with thickness of 150 nm could be reversibly stretched up to 30% elongation on polydimethylsiloxane (PDMS) substrate with 150-nm-thick Parylene C…”
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