Search Results - "Szwech, M."
-
1
New flip-chip assembly system for prototyping and process investigations
Published in 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) (2001)“…The flip-chip assembly technology and a new laboratory stand for investigation of FC bonding processes are presented. The prototype system was developed by…”
Get full text
Conference Proceeding
-
2
Life-time of lead-free soldered SMT joints
Published in 2008 31st International Spring Seminar on Electronics Technology (01-05-2008)“…The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and…”
Get full text
Conference Proceeding -
3
Infant mortality failures of lead - free solder joints
Published in 2009 32nd International Spring Seminar on Electronics Technology (01-05-2009)“…Two goals of the work - verification of suitability of mechanical tests of solder joints reliability and infant mortality (early failures) of lead-free joints…”
Get full text
Conference Proceeding -
4
Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints
Published in 2007 30th International Spring Seminar on Electronics Technology (ISSE) (01-05-2007)“…One of the main goals in development of electronics manufacturing technology, after implementation of EU Directive RoHS, is the reliability improvement of…”
Get full text
Conference Proceeding -
5
Economic reliability test methods of new soldering materials
Published in 33rd International Spring Seminar on Electronics Technology, ISSE 2010 (01-05-2010)“…According to RoHS directive, many new electronic products are manufactured by using of new technology and lead-free soldering materials. For reduction of the…”
Get full text
Conference Proceeding -
6
Quality Management in Electronics Manufacturing after Implementation of RoHS Directive
Published in 2007 30th International Spring Seminar on Electronics Technology (ISSE) (01-05-2007)“…The improvement of electronic interconnection systems reliability after implementation of EU Directive RoHS is currently one of the main goals in development…”
Get full text
Conference Proceeding -
7
Resistance Measurements of BGA Contacts During Reliability Tests
Published in 2006 29th International Spring Seminar on Electronics Technology (01-05-2006)“…For mechanical fatigue tests were designed special test models of BGA package and test board, for measurements of solder joints and ball contact resistance by…”
Get full text
Conference Proceeding -
8
Characteristics of Accelerated Fatigue Tests by Cyclic Flexion of SMT PC boards
Published in 2006 29th International Spring Seminar on Electronics Technology (01-05-2006)“…The critical problem by implementation the EU RoHS directive is assurance of existing level of electronic products reliability. For accelerated reliability…”
Get full text
Conference Proceeding -
9
Mechanical cycling in accelerated life - time tests of lead - free soldered joints
Published in 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005 (2005)“…Typical accelerated life-time tests of soldered joints are temperature cycling and thermal shock cycling. In last time other, more economical and effective…”
Get full text
Conference Proceeding -
10
"Pseudo-infarction pattern" in the course of pulmonary embolism
Published in Pneumonologia i alergologia polska (1996)Get more information
Journal Article