Search Results - "Szornel, Julia E"
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1
Atomic layer etching of SiO2 with Ar and CHF3 plasmas: A self‐limiting process for aspect ratio independent etching
Published in Plasma processes and polymers (01-09-2019)“…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
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Journal Article -
2
Atomic layer etching of SiO2 with Ar and CHF 3 plasmas: A self‐limiting process for aspect ratio independent etching
Published in Plasma processes and polymers (01-09-2019)“…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
Get full text
Journal Article -
3
Atomic layer etching of SiO 2 with Ar and CHF 3 plasmas: A self‐limiting process for aspect ratio independent etching
Published in Plasma processes and polymers (01-09-2019)“…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
Get full text
Journal Article