Search Results - "Szornel, Julia E"

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  1. 1

    Atomic layer etching of SiO2 with Ar and CHF3 plasmas: A self‐limiting process for aspect ratio independent etching by Dallorto, Stefano, Goodyear, Andy, Cooke, Mike, Szornel, Julia E, Ward, Craig, Kastl, Christoph, Schwartzberg, Adam, Rangelow, Ivo W, Cabrini, Stefano

    Published in Plasma processes and polymers (01-09-2019)
    “…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
    Get full text
    Journal Article
  2. 2

    Atomic layer etching of SiO2 with Ar and CHF 3 plasmas: A self‐limiting process for aspect ratio independent etching by Dallorto, Stefano, Goodyear, Andy, Cooke, Mike, Szornel, Julia E., Ward, Craig, Kastl, Christoph, Schwartzberg, Adam, Rangelow, Ivo W., Cabrini, Stefano

    Published in Plasma processes and polymers (01-09-2019)
    “…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
    Get full text
    Journal Article
  3. 3

    Atomic layer etching of SiO 2 with Ar and CHF 3 plasmas: A self‐limiting process for aspect ratio independent etching by Dallorto, Stefano, Goodyear, Andy, Cooke, Mike, Szornel, Julia E., Ward, Craig, Kastl, Christoph, Schwartzberg, Adam, Rangelow, Ivo W., Cabrini, Stefano

    Published in Plasma processes and polymers (01-09-2019)
    “…With ever increasing demands on device patterning to achieve smaller critical dimensions, the need for precise, controllable atomic layer etching (ALE) is…”
    Get full text
    Journal Article