Search Results - "Sugiura, Kazuhiko"

High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates by Chen, Chuantong, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…Ag sinter joining technology has been used in the advanced power applications to replace conventional soldering technology due to its high temperature…”
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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Sugahara, Tohru, Zhang, Hao, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The application of microporous sintered silver (Ag) as a bonding material to replace conventional die-bonding materials in power electronic devices has…”
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Self-healing of cracks in Ag joining layer for die-attachment in power devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection…”
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Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design by Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The mechanical properties of sintered Ag paste with microporous structure have been investigated by tensile and shear tests, focusing on the…”
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Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles by Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…Sintered silver (Ag) die-attach has attracted much attention in assembling power modules for high power density and high temperature operation. We have…”
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Resistance factors of pecky rice incidence caused by the rice stink bugs (Leptocorisa chinensis, Nezara viridula) in rice line CRR-99-95W by Sugiura, Kazuhiko, Oi, Takao, Tanaka, Toshiharu, Hamagashira, Aoi, Ouk, Rachana, Nakamura, Mitsuru, Ide, Yasuto, Tsuda, Kengo, Ito, Akira, Yamauchi, Akira

“…Pecky rice incidence caused by rice stink bugs greatly decreases the quality of rice grain and has come a big problem not only in Japan but also many other…”
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CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…One of the applications of wide band gap semiconductors is high temperature operation. That application requires high temperature compatible (i) joining…”
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High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics by Sungwon Park, Nagao, Shijo, Kato, Yoshitaka, Ishino, Hiroshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…Pure Zn is a Pb-free die-attach material considered suitable for application in high-temperature electronics such as widebandgap semiconductor devices, as it…”
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Reduction of Rice Chalky Grain by Deep and Permanent Irrigation Method; Effect on Growth and Grain Quality of Rice by Hayashi, Motoki, Sugiura, Kazuhiko, Kuno, Chikako, Endo, Ikuma, Tanaka, Yuichi, Yamauchi, Akira

“…Formation of chalky grains which is the main cause of the degradation of rice grain quality occurs frequently when the temperature during the 20 days after…”
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Prominent interface structure and bonding material of power module for high temperature operation by Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chuantong Chen, Nagao, Shijo, Hao Zhang, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori

“…Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of…”
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Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique by Zhang, Zheng, Chen, Chuantong, Suetake, Aiji, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…In this work, an acoustic emission (AE) technique was applied to online condition monitoring (CM) of solder fatigue in a clip-bonding SiC mosfet power assembly…”
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Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure by Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Funaki, Tsuyoshi, Suganuma, Katsuaki

“…Silicon carbide (SiC) power modules with Ag sinter-bonding die attach were designed on the basis of thermal stress analysis for reliable high-temperature…”
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High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
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Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…The application of Co-W-P plating technology in high-temperature package structure is advantageous from a point of structural reliability because Co-W-P…”
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Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application by Tatsumi, Kohei, Inagaki, Masakazu, Kamei, Kazuhito, Iizuka, Tomonori, Narimatsu, Hiroaki, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Imakiire, Akihiro, Hikita, Masayuki, Kamimura, Rikiya, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…Aiming for application to the inverter system of HEV and EV, we have developed a novel packaging technique for SiC power devices based on Nickel Micro Plating…”
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6-in-1 Silicon carbide power module for high performance of power electronics systems by Ishino, Hiroshi, Watanabe, Tomokazu, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The excellent characteristics (low power loss, high speed/high temperature operation) of SiC semiconductors can contribute to realizing smaller power converter…”
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In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature by Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…We carried out in situ transmission electron microscopy (TEM) on the microstructural change of a sintered Ag die-attach layer heated to 600 °C. It was found…”
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Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density by Chen, Chuantong, Iwaki, Aya, Suetake, Aiji, Sugiura, Kazuhiko, Kanie, Kiyoshi, Suganuma, Katsuaki

“…Cu sinter joining technology have got a lot attention for next-generation wide band gap (WBG) power modules which will subject a high temperature above 250 °C…”
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Effect of annealing Co-W-P metallization substrate onto its resin adhesion by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…The use of a Co-W-P metallization substrate in SiC power modules is expected to improve high temperature reliability because Co-W-P metallization has been…”
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Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique by Zhang, Zheng, Suetake, Aiji, Chen, Chuantong, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…In this work, we applied a acoustic emission monitoring (AEM) technique to inspect solder deterioration in a clip-bonding SiC MOSFET power module during power…”
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