Search Results - "Su, Thonas"
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1
Cost-effective characterization of dissipative loss of printed circuit board traces
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-07-2016)“…Determining how to accurately estimate and control the loss of a channel is critical to the success of the design of a high-speed I/O link. As Printed circuit…”
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2
An Innovative Customized PCB Surface Printing for Performance Enhancement
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…In this paper, a novel and effective approach by the innovative customized PCB surface printing was proposed to reduce far-end crosstalk (FEXT) in multiple…”
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3
DDR Debug Methodology for Board Design Quality and System Robustness
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…System performance is a major indicator of a workstation or server. Besides the CPU's (Central Processing Unit) computing power, the DRAM (Dynamic…”
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4
Printed Circuit Board (PCB) Routing optimization with an Innovative Edge Connector for PCI-Express 5.0 and Beyond
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…PCI-Express (PCIe) data rate continues to double generation by generation from PCIe 4.0 with 16Gbps, PCIe 5.0 with 32Gbps to PCIe 6.0 with 64Gbps in recent…”
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5
Improve signal integrity performance by using hybrid PCB stackup
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01-08-2013)“…FR4 is a commonly used material in industry to build printed circuit boards. However signals propagating in this media have significant attenuation when date…”
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6
Checking PCB design electrically for PI/SI issues
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-08-2014)“…In this paper, the signal integrity (SI) simulation and computer system electrical design flow is discussed. Traditionally, the SI analyses lead to a set of…”
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7
PCIe-Express Channel Design Optimization for Out-of-Guideline Three Connector Topology
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…PCI-Express (PCIe) channel design is very challenging for 32GT/s applications, and channel loss management and impedance matching are very important for system…”
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8
Asymmetric Hybrid PCB Design for Cost-Effective and Performance-Driven Solution in Data Center Platforms
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25-10-2023)“…Hybrid PCB (Printed Circuit Board), which are constructed by mixing different PCB materials, has become increasingly popular in various industries in recent…”
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9
High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…There are more and more PCB design challenges in data center platform design by thousands of signals and higher speed data rate. Designers need to adopt…”
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10
Robotic System with Intel® Automatic In-Board Characterization for Customer Board Design Quality Check
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21-12-2021)“…Intel ® Automatic In-Board Characterization (AIBC) is established for fast, robust, and accurate printed circuit board (PCB) characterization. It can provide…”
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11
Enhanced System Level Channel Characterization Methodology with Seamless Correlation among Hardware, Signal Integrity and Electrical Validation for Design Robustness
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…The proposed methodology demonstrates an effective approach to characterize channel design and closed-loop interactions between electrical validation and…”
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12
Enhanced Board Level Design Methodology by Statistical Analysis
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21-10-2020)“…Today's server system design becomes more and more challenging and complex due to the data speed of high-speed (HS) input/output (I/O) interfaces increases…”
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13
Enhanced Simulation Methodology For High-Speed Data Center Application
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21-10-2020)“…Comparisons among commonly used EDA tools[]-[] are demonstrated, simulations are conducted on a simple but canonical low-loss test coupon. Then HSIO routings…”
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14
Semi-automation Delta-L for PCB Loss Electrical Characterization
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2018)“…In high-frequency electrical characterization, it is very important to have good measurement stability and repeatability. Conventionally, co-axial connector is…”
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15
Board Design Architecture and optimization for High-power 48V Voltage Regulator
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26-10-2022)“…Datacenters towards low carbon emission, low energy consumption, green energy saving, and sustainability has become the trends. Using 48V as the intermediate…”
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16
Modified Channel Quality Comparison for PCI Express 4.0
Published in 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) (01-06-2019)“…The Channel Quality Comparison (CQC) method was introduced in 2011 [1] . It is commonly used in the pre-layout simulation to estimate the risk of the channel,…”
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17
Microstrip signal integrity enhancement by using low-loss solder mask
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2017)“…Microstrip design in printed circuit board (PCB) suffers potential high insertion loss or higher crosstalk, compared to stripline. The loss of microstrip has…”
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18
Advanced Channel Analysis Method using Channel Quality Comparison and Design of Experiments
Published in 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) (01-06-2019)“…A new SI simulation method called Advanced CQC is introduced. Advanced CQC Method can help PCB designers to check the board design quality quickly and also…”
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19
Statistical and Comparative Simulation Methods for High Speed Interfaces
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2019)“…The DOE/RSM/UPM (Design of Experiment/Response Surface Methodology/Unit per Million) method based on statistical approach is used commonly in the industry to…”
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20
Advanced Channel Analysis Method using Channel Quality Comparison and Design of Experiments
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2018)“…The design phases of a sever product are often very long. It often takes average one and half years from feasibility study phase to mass production. The layout…”
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