Search Results - "Stoffel, Nancy"
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5G-enabled, battery-less smart skins for self-monitoring megastructures and digital twin applications
Published in Scientific reports (01-05-2024)“…With the current development of the 5G infrastructure, there presents a unique opportunity for the deployment of battery-less mmWave reflect-array-based…”
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Journal Article -
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Precision Dispensed Die Fillets as Nonconformal Surfaces for Printed Interconnects: Characterization, Optimization, and Mechanical Performance Assessment
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-04-2021)“…The ability to fabricate smooth transitions between surfaces at different levels is critical for the establishment of robust printed interconnections in…”
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Journal Article -
3
Flexible inkjet-printed Patch antenna array on mesoporous PET substrate for 5G applications with stable RF performance after mechanical stress cycling
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…In this paper, an inkjet-printed 2-element patch antenna array was printed on silica coated porous polyethylene terephthalate (PET) with compatible silver ink…”
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Conference Proceeding -
4
Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications
Published in Advanced engineering materials (01-10-2023)“…There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require…”
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5
Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…The development of reliable Flexible Hybrid Electronics (FHE) that are light, wearable and conforming to the human body while still preserving full operational…”
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Conference Proceeding -
6
Printed electronics for extreme high temperature environments
Published in Additive manufacturing (01-06-2022)“…There is a rapidly growing interest in the development of electronic microsystems that can maintain functionality in high temperature environments,…”
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Surface Modification Studies of Polyimide Films Using Rutherford Backscattering and Forward Recoil Spectrometry
Published in Chemistry of materials (1996)“…We followed the surface imide ring hydrolysis of fully imidized polyimide films by aqueous base solutions using Rutherford backscattering spectrometry. The…”
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High-Resolution Profiling of the Polyimide−Polyimide Interface
Published in Macromolecules (07-10-1996)“…Dynamic secondary ion mass spectrometry (SIMS), nuclear reaction analysis, and neutron reflectometry were used to profile polyimide−polyimide interfaces. For…”
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9
Forward recoil spectrometry study of the diffusion of PMDA/ODA-based poly(amic ethyl esters)
Published in Polymer (Guilford) (01-09-1997)“…The poly(amic ethyl esters) (PAEs) of pyromellitic dianhydride/4,4′-oxydianiline (PMDA/ODA) were prepared in three isomeric forms, with meta-linkages,…”
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10
Conformal Dry Electrode for ECG Monitoring
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28-05-2024)“…This work reports the fabrication and testing of a conformal and soft dry electrode for Electrocardiogram (ECG) monitoring to address the limitations…”
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Conference Proceeding -
11
Evaluation of Materials for the Design and Development of Sustainable Low-Cost Single-Use Electrode Leads for Wearable Medical Devices
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28-05-2024)“…Wearable medical devices have revolutionized continuous health monitoring, offering real-time data collection and enhanced patient care. Among the crucial…”
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Conference Proceeding -
12
Fast PCR Thermal Cycling Device
Published in IEEE sensors journal (01-05-2008)“…A novel flow-through device for performing fast PCR thermal cycling is presented. The thermal gradient thermal cycling device is comprised of layers of highly…”
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Journal Article -
13
Evaluation of an Anisotropic Conductive Epoxy for Interconnecting Highly Stretchable Conductors to Various Surfaces
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01-05-2022)“…Stretchable wearable electronics often require integrating mechanically different materials to fabricate functional devices that are stretchable, conformal,…”
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Conference Proceeding -
14
Robustness and Reliability of Novel Anisotropic Conductive Epoxy for Stretchable Wearable Electronics
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01-05-2022)“…Stretchable electronic devices are hybrid in nature, comprised of soft and rigid electronic components. Robust and reliable electrical interconnections that…”
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Conference Proceeding -
15
High Temperature Die Interconnection Approaches
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01-05-2022)“…High temperature electronics face obvious challenges in terms of high temperature endurance, a wide range of thermal cycling, and fabrication processes. A…”
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Conference Proceeding -
16
The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01-05-2022)“…Reliability of all-printed vias fabricated on flexible polymer substrates is crucial for the proper functionality of flexible hybrid electronics (FHE) which…”
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Conference Proceeding -
17
Textile Based Sensing Blanket for ECG Monitoring in the Intensive Care Unit
Published in 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) (01-07-2020)“…Multiple designs of textile-based sensors were developed and integrated into blankets for the measurement of Electrocardiogram (ECG) signals. Once the patient…”
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Conference Proceeding -
18
Micro-Hermetic Packaging Technology for Active Implantable Neural Interfaces
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01-05-2017)“…In this paper, we propose a fused silica packaging platform with a micro-cavity designed to house and protect active electronics for neural interfaces…”
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Conference Proceeding -
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Effects of Oven and Laser Sintering Parameters on the Electrical Resistance of IJP Nano-Silver Traces on Mesoporous PET Before and During Fatigue Cycling
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01-05-2019)“…Inkjet printing of conducting traces offers well established advantages and disadvantages as an alternative to electroplating of interconnects in flexible…”
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Conference Proceeding -
20
A Comparative Study of Aerosol Jet Printing on Polyimide and Liquid Crystal Polymer Substrates for RF Applications
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…Aerosol jet printing has been emerging as an attractive circuit fabrication technique in flexible and wearable radio frequency (RF) electronics due to the…”
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Conference Proceeding