Search Results - "Steinhäuser, Edith"

The effect of Ni on the kinetics of electroless Cu film deposition by Logan, Eric, Sharma, Tanu, Brüning, Frank, Zarwell, Sebastian, Steinhäuser, Edith, Bernhard, Tobias, Chen, Ning, Brüning, Ralf

“…Plating rates and Ni co-deposition were measured for electroless Cu plating baths without and with an added proprietary stabilizer system. The bath has…”
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Potential low-cost palladium-alternatives for activating electroless copper deposition by Steinhaeuser, Edith

“…Purpose - The purpose of this paper is the investigation of the catalytic activities of selected metals in reductant oxidation.Design methodology approach -…”
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Chemical "kick start" for the autocatalytic formaldehyde-free electroless copper plating process by Steinhäuser, Edith, Stamp, Lutz, Brandt, Lutz

“…Purpose - The purpose of this paper is to examine the use of additives in formaldehyde-free copper-plating solutions with low reducing agent (RA) concentration…”
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Smart Electroless Copper Bath for SAP Applications by Bremmert, Stefanie Manuela, Dieter, Sascha, Friz, Wolfgang, Gregoriades, Laurence John, Roseler, Sandra, Steinhauser, Edith

“…Several electroless copper bath features such as bath stability, copper deposit color and crystal structure, throwing power and suppression of nanovoiding, are…”
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Hydrogen Embrittlement Suppressors for Nickel-Free Electroless Copper Baths by Bernhard, Tobias, Bremmert, Stefanie Manuela, Dieter, Sascha, Gregoriades, Laurence John, Steinhauser, Edith

“…The deposition of a nanovoid-free electroless copper layer is one of the main quality criteria of an electroless copper bath. Without certain additives known…”
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Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films by Bernhard, Tobias, Steinhauser, Edith, Kempa, Stefan, Krilles, Gerson, Massey, Roger, Bruning, Frank

“…Hydrogen is inevitably produced during electroless Cu plating, it accumulates on the Cu-surface, forms gas bubbles and sticks on the as-growing Cu surface. The…”
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The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films by Bernhard, Tobias, Zarwell, Sebastian, Steinhauser, Edith, Kempa, Stefan, Bruning, Frank

“…The electrical reliability of multilayer High Density Interconnection Printed Circuit boards (HDI PCBs) is mainly affected by the thermo-mechanical stability…”
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