Search Results - "Steiner, Felix"

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  1. 1
    Analysing and Optimising Informed Consent in Cooperation with Ethics Committees and Medical Researchers

    Analysing and Optimising Informed Consent in Cooperation with Ethics Committees and Medical Researchers by Matic, Igor, De Nardi, Gianni, Steiner, Felix

    Published in AILA review (01-01-2021)
    “…Medical researchers are ethically and legally required to inform participants and get written permission before enrolling them into a human research project…”
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  2. 2
    Temperature-Dependent Degradation of SiC Schottky Diode Inhibition Effect on SiC MOSFET Body Diode Reverse Recovery Current

    Temperature-Dependent Degradation of SiC Schottky Diode Inhibition Effect on SiC MOSFET Body Diode Reverse Recovery Current by Zhang, Hongpeng, Steiner, Felix, Demattio, Horst, Blank, Thomas

    “…Integrating an external Silicon Carbide (SiC) Schottky barrier diode (SBD) significantly enhances the reverse recovery performance of the power converters…”
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  3. 3
    Large Area Powermodule Sintering Using Porous Copper

    Large Area Powermodule Sintering Using Porous Copper by Blank, Thomas, Steiner, Felix, Ishikawa, Dai, Nakako, Hideo

    “…SiC power modules operate at 175°C and above. These high temperatures pose reliability problems for the soldered interface layer between the bulk copper of the…”
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  4. 4
    Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue

    Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue by Steiner, Felix, Blank, Thomas, Ishikawa, Dai, Nakako, Hideo

    “…In previous HV-H3TRB testing severe dendrite growth was observed on power MOSFETs. In this work we investigated the influence of solder flux residue on the…”
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  5. 5
    Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag

    Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag by Ishikawa, Dai, Nakako, Hideo, Blank, Thomas, Steiner, Felix

    “…Die-bonding technology using a Cu sinter paste is an attractive and promising joint method for high-power devices operating at higher temperatures. However,…”
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  6. 6
    Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)

    Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx) by Ishikawa, Dai, Nakako, Hideo, Blank, Thomas, Wurst, Helge, Steiner, Felix

    “…Die-bonding technology using a sintering reaction of Cu nanoparticles at low temperatures is an attractive and important joint method for power devices…”
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  7. 7
    Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling

    Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling by Steiner, Felix, Ishikawa, Dai, Nakako, Hideo, Blank, Thomas

    “…Copper sintering is a promising alternative to silver sintering as die-attach in power electronic systems with the advantage of lower cost, lower coefficient…”
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  8. 8
    Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating

    Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating by Ishikawa, Dai, Blank, Thomas, Wurst, Helge, Steiner, Felix, Nakako, Hideo

    “…Die-bonding technology using Cu sinter pastes is an attractive and important joint method for power devices operating at higher temperatures. This paper…”
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  9. 9
    Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice

    Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice by Steiner, Felix, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Nakako, Hideo, Blank, Thomas

    “…Soft silicone gels, as the standard potting materials for power electronic modules, provide little protection against water ingress and thus cannot protect the…”
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  10. 10
    Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging

    Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging by Tsai, Chin-Hao, Steiner, Felix, Ishikawa, Dai, Kao, C. Robert, Blank, Thomas

    “…In this research, Ag, Cu, mixed Ag-In, and mixed Ag-SAC sinter pastes are used for large-area bonding in second-level power module packaging. Due to the large…”
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  11. 11
    Copper sintered Si3N4 Power Modules in Thermal Shock Tests

    Copper sintered Si3N4 Power Modules in Thermal Shock Tests by Blank, Thomas, Zhang, Hongpeng, Wurst, Helge, Leyrer, Benjamin, Steiner, Felix, Ishikawa, Dai, Geckele, Udo, Peric, Ivan

    “…The mechanical behavior of Al 2 O 3 -DCB and Si 3 N 4 -AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles…”
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  12. 12
    Effects of ACTH and corticosteroids on single neurons in the hypothalamus

    Effects of ACTH and corticosteroids on single neurons in the hypothalamus by Steiner, F A

    Published in Progress in brain research (1970)
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  13. 13
    Influence of microelectrophoretically applied acetylcholine on the responsiveness of hippocampal and lateral geniculate neurones

    Influence of microelectrophoretically applied acetylcholine on the responsiveness of hippocampal and lateral geniculate neurones by Steiner, F A

    Published in Pflügers Archiv (01-01-1968)
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  14. 14
    L-glutamic acid, gamma-aminobutyric acid and pyridoxal-5'-phosphate at the level of the single unit in rat brain

    L-glutamic acid, gamma-aminobutyric acid and pyridoxal-5'-phosphate at the level of the single unit in rat brain by Steiner, F A

    Published in Annals of the New York Academy of Sciences (30-09-1969)
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  15. 15
    14 AND 6 CPS POSITIVE EEG SPIKES IN A FAMILY

    14 AND 6 CPS POSITIVE EEG SPIKES IN A FAMILY by ZITRIN, C, GREENBERG, I M, STEINER, F

    Published in Archives of general psychiatry (01-12-1963)
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