Search Results - "Stan, M R"

Low-power encodings for global communication in CMOS VLSI by Stan, M.R., Burleson, W.P.

“…Technology trends and especially portable applications are adding a third dimension (power) to the previously two-dimensional (speed, area) VLSI design space…”
Get full text

Diluted chirality dependence in edge rough graphene nanoribbon field-effect transistors by Tseng, F., Unluer, D., Holcomb, K., Stan, M. R., Ghosh, A. W.

“…We investigate the role of various structural nonidealities on the performance of armchair-edge graphene nanoribbon field effect transistors (GNRFETs). Our…”
Get full text

Molecular electronics: from devices and interconnect to circuits and architecture by Stan, M.R., Franzon, P.D., Goldstein, S.C., Lach, J.C., Ziegler, M.M.

“…As the dominating CMOS technology is fast approaching a "brick wall," new opportunities arise for competing solutions. Nanoelectronics has achieved several…”
Get full text

Long and fast up/down counters by Stan, M.R., Tenca, A.F., Ercegovac, M.D.

“…This paper presents recent advances in the design of constant-time up/down counters in the general context of fast counter design. An overview of existing…”
Get full text

CMOS/nano co-design for crossbar-based molecular electronic systems by Ziegler, M.M., Stan, M.R.

“…Future electronic systems will need to adopt novel nanoelectronic solutions to keep pace with Moore's Law. Crossbar-based molecular electronics are among the…”
Get full text

Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management by Skadron, K., Abdelzaher, T., Stan, M.R.

“…This paper proposes the use of formal feedback control theory as a way to implement adaptive techniques in the processor architecture. Dynamic thermal…”
Get full text

Bus-invert coding for low-power I/O by Stan, M.R., Burleson, W.P.

“…Technology trends and especially portable applications drive the quest for low-power VLSI design. Solutions that involve algorithmic, structural or physical…”
Get full text

HotSpot: a dynamic compact thermal model at the processor-architecture level by Stan, Mircea R., Skadron, Kevin, Barcella, Marco, Huang, Wei, Sankaranarayanan, Karthik, Velusamy, Sivakumar

“…This paper describes a thermal-modeling approach that is easy to use and computationally efficient for modeling thermal effects and thermal-management…”
Get full text

Power-aware computing by Stan, M.R., Skadron, K.

“…Performance, complexity, cost, and power tradeoffs have created exciting challenges and opportunities in the rapidly changing field of power-aware computing…”
Get full text

Temperature-aware computer systems: Opportunities and challenges by Skadron, K., Stan, M.R., Wei Huang, Velusamy, S., Sankaranarayanan, K., Tarjan, D.

“…Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level…”
Get full text

Low-power CMOS with subvolt supply voltages by Stan, M.R.

“…We first present a circuit taxonomy along the space and time dimensions, which is useful for classifying generic low-power techniques, followed by an analysis…”
Get full text

Improved thermal management with reliability banking by Lu, Z., Lach, J., Stan, M.R., Skadron, K.

“…Using a fixed temperature for thermal throttling is pessimistic. Reduced aging during periods of low temperature can compensate for accelerated aging during…”
Get full text

The gravity of the status quo: the response of research governance to system-level shocks by Derrick, G. E., Robson, J., Oancea, A., Xu, X., Stan, M. R.

“…Abstract Using interviews with global research stakeholders, this research explores how stakeholders within research-system-level research governance…”
Get full text

Power issues related to branch prediction by Parikh, D., Skadron, K., Yan Zhang, Barcella, M., Stan, M.R.

“…This paper explores the role of branch predictor organization in power/energy/performance tradeoffs for processor design. We find that as a general rule, to…”
Get full text

Parameterized physical compact thermal modeling by Wei Huang, Stan, M.R., Skadron, K.

“…This paper presents a compact thermal modeling (CTM) approach, which is fully parameterized according to design geometries and material physical properties…”
Get full text

HotSpot: a compact thermal modeling methodology for early-stage VLSI design by Wei Huang, Ghosh, S., Velusamy, S., Sankaranarayanan, K., Skadron, K., Stan, M.R.

“…This paper presents HotSpot-a modeling methodology for developing compact thermal models based on the popular stacked-layer packaging scheme in modern very…”
Get full text

Large-signal two-terminal device model for nanoelectronic circuit analysis by Rose, G.S., Ziegler, M.M., Stan, M.R.

“…As the nanoelectronics field reaches the maturity needed for circuit-level integration, modeling approaches are needed that can capture nonclassical behaviors…”
Get full text

5-GHz 32-bit integer execution core in 130-nm dual-V/T/ CMOS by Vangal, S, Anders, M A, Borkar, N, Seligman, E, Govindarajulu, V, Erraguntla, V, Wilson, H, Pangal, A, Veeramachaneni, V, Tschanz, J W, Ye, Y, Somasekhar, D, Bloechel, B A, Dermer, G E, Krishnamurthy, R K, Soumyanath, K, Mathew, S, Narendra, S G, Stan, M R

“…A 32-bit integer execution core containing a Han-Carlson arithmetic-logic unit (ALU), an 8-entry x 2 ALU instruction scheduler loop and a 32-entry x 32-bit…”
Get full text

Relaxing non-volatility for fast and energy-efficient STT-RAM caches by Smullen, C W, Mohan, V, Nigam, A, Gurumurthi, S, Stan, M R

“…Spin-Transfer Torque RAM (STT-RAM) is an emerging non-volatile memory technology that is a potential universal memory that could replace SRAM in processor…”
Get full text

Modeling Power Consumption of NAND Flash Memories Using FlashPower by Mohan, V., Bunker, T., Grupp, L., Gurumurthi, S., Stan, M. R., Swanson, S.

“…Flash is the most popular solid-state memory technology used today. A range of consumer electronics products, such as cell-phones and music players, use flash…”
Get full text