Search Results - "Städele, M."

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  1. 1

    Simulation of nanoscale MOSFETs using modified drift-diffusion and hydrodynamic models and comparison with Monte Carlo results by Granzner, R., Polyakov, V.M., Schwierz, F., Kittler, M., Luyken, R.J., Rösner, W., Städele, M.

    Published in Microelectronic engineering (01-02-2006)
    “…The dc behavior of single-gate and double-gate MOSFETs with gate lengths ranging from 5 to 100 nm is simulated using drift-diffusion, hydrodynamic, and Monte…”
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    Journal Article
  2. 2

    NVM based on FinFET device structures by Hofmann, F., Specht, M., Dorda, U., Kömmling, R., Dreeskornfeld, L., Kretz, J., Städele, M., Rösner, W., Risch, L.

    Published in Solid-state electronics (01-11-2005)
    “…High density data flash memories are essentially used in mobile applications. Flash devices have a small form factor, high storage density and low power…”
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    Journal Article Conference Proceeding
  3. 3

    Transport mechanisms in atomic-layer-deposited Al2O3 dielectrics by Specht, M., Städele, M., Jakschik, S., Schröder, U.

    Published in Applied physics letters (19-04-2004)
    “…We analyze the field and temperature dependence of electron currents through atomic-layer-deposited thin (3.6–6 nm) sheets of Al2O3 which were annealed above…”
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    Journal Article
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    Design considerations for fully depleted SOI transistors in the 25–50 nm gate length regime by Luyken, R.J., Schulz, T., Hartwich, J., Dreeskornfeld, L., Städele, M., Rösner, W.

    Published in Solid-state electronics (01-07-2003)
    “…Drift-diffusion simulations have been carried out to investigate the design space for n-channel fully depleted (FD) SOI transistors with undoped channels and…”
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    Journal Article
  6. 6

    Metallization of molecular hydrogen: predictions from exact-exchange calculations by Städele, M, Martin, R M

    Published in Physical review letters (26-06-2000)
    “…We study metallization of molecular hydrogen under pressure using exact-exchange (EXX) Kohn-Sham density-functional theory in order to avoid well-known…”
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    Journal Article
  7. 7

    Tunneling through Thin Oxides—New Insights from Microscopic Calculations by Städele, M, Tuttle, B, Fischer, B, Hess, K

    Published in Journal of computational electronics (01-07-2002)
    “…In this paper, we summarize our recent efforts to analyze transmission probabilities of extremely thin SiO2 gate oxides using microscopic models of…”
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    Journal Article
  8. 8

    Full-Band Tunneling Currents in Nanometer-Scale MOS Structures by Sacconi, F., Di Carlo, A., Lugli, P., Städele, M.

    Published in Journal of computational electronics (01-12-2003)
    “…Using quantum mechanical methods that include the full band structure of Si and SiO2 and a self-consistent potential, we study tunneling through ultrathin…”
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    Journal Article
  9. 9

    Influence of crystal orientation and body doping on trigate transistor performance by Landgraf, E., Rösner, W., Städele, M., Dreeskornfeld, L., Hartwich, J., Hofmann, F., Kretz, J., Lutz, T., Luyken, R.J., Schulz, T., Specht, M., Risch, L.

    Published in Solid-state electronics (2006)
    “…This work characterizes long channel trigate transistors with respect to the systematic influence of crystal orientation and body doping on performance issues…”
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    Journal Article Conference Proceeding
  10. 10

    Novel dual bit tri-gate charge trapping memory devices by Specht, M., Kommling, R., Hofmann, F., Klandzievski, V., Dreeskornfeld, L., Weber, W., Kretz, J., Landgraf, E., Schulz, T., Hartwich, J., Rosner, W., Stadele, M., Luyken, R.J., Reisinger, H., Graham, A., Hartmann, E., Risch, L.

    Published in IEEE electron device letters (01-12-2004)
    “…Dual bit operation of fabricated tri-gate nonvolatile memory devices with aggressively scaled oxide-nitride-oxide (ONO) dielectrics is presented for the first…”
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    Journal Article
  11. 11

    Full band approach to tunneling in MOS structures by Sacconi, F., Di Carlo, A., Lugli, P., Stadele, M., Jancu, J.-M.

    Published in IEEE transactions on electron devices (01-05-2004)
    “…Using atomistic quantum mechanical tight-binding (TB) methods that include the full band structure, we study electron tunneling through three-dimensional…”
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    Journal Article
  12. 12
  13. 13

    Reduction of layout variations with stress-compensated hybrid STI fills: a comprehensive analysis by Stadele, M., Ilicali, G., Landgraf, E., Goldbach, M., Finsterbusch, S., Lindolf, J., Radecker, J., Uhlig, B.

    “…Based on a detailed I-V analysis, 2D/3D process/device simulation, and inline wafer bow measurements, we have investigated a number of stress-induced layout…”
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    Conference Proceeding
  14. 14

    Nanoscale FinFETs for low power applications by Rösner, W., Landgraf, E., Kretz, J., Dreeskornfeld, L., Schäfer, H., Städele, M., Schulz, T., Hofmann, F., Luyken, R.J., Specht, M., Hartwich, J., Pamler, W., Risch, L.

    Published in Solid-state electronics (01-10-2004)
    “…N and p channel FinFETs with fin widths in the range of 15–30 nm and gate lengths down to 20 nm have been processed using e-beam-lithography and nano-etching…”
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    Journal Article
  15. 15

    Multi-level p+ tri-gate SONOS NAND string arrays by Friederich, C., Specht, M., Lutz, T., Hofinann, F., Dreeskornfeld, L., Weber, W., Kretz, J., Melde, T., Rosner, W., Landgraf, E., Hartwich, J., Stadele, M., Risch, L., Richter, D.

    “…Tri-gate silicon-oxide-nitride-oxide-silicon (SONOS) NAND string arrays with p+ gate for multi-level high density data flash applications have been fabricated…”
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    Conference Proceeding
  16. 16

    Fabrication of ultra-thin-film SOI transistors using the recessed channel concept by Dreeskornfeld, L., Hartwich, J., Hofmann, F., Kretz, J., Landgraf, E., Luyken, R.J., Rösner, W., Schröter, R., Schulz, T., Specht, M., Städele, M., Weber, W., Risch, L.

    Published in Microelectronic engineering (01-03-2005)
    “…In this article, ultra-thin-film SOI transistors fabricated by locally recessing the channel regions are presented. SOI MOSFETs with ultra-thin channels offer…”
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    Journal Article Conference Proceeding
  17. 17

    Impact of technology parameters on device performance of UTB-SOI CMOS by Schulz, T., Pacha, C., Luyken, R.J., Städele, M., Hartwich, J., Dreeskornfeld, L., Landgraf, E., Kretz, J., Rösner, W., Specht, M., Hofmann, F., Risch, L.

    Published in Solid-state electronics (01-04-2004)
    “…Ultra-thin-body silicon-on-insulator (UTB-SOI) is one of the most promising candidates for future CMOS technologies with minimum feature sizes below 50 nm. In…”
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    Journal Article
  18. 18
  19. 19

    Sub-40nm tri-gate charge trapping nonvolatile memory cells for high-density applications by Specht, M., Kommling, R., Dreeskornfeld, L., Weber, W., Hofmann, F., Alvarez, D., Kretz, J., Luyken, R.J., Rosner, W., Reisinger, H., Landgraf, E., Schulz, T., Hartwich, J., Stadele, M., Klandievski, V., Hartmann, E., Risch, L.

    “…Fully-depleted tri-gate oxide-nitride-oxide (ONO) transistor memory cells with very short gate lengths in the range L/sub G/ = 30 - 80 nm have been fabricated…”
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    Conference Proceeding
  20. 20

    Perspectives of fully-depleted SOI transistors down to 20nm gate length by LUYKEN, R. J, STÄDELE, M, RÖSNER, W, SCHULZ, T, HARTWICH, J, DREESKORNFELD, L, RISCH, L

    “…Device simulations have been carried out for n-channel fully depleted SOI transistors with undoped channels and single gates. Si body thickness, lateral…”
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    Conference Proceeding