Search Results - "Srikar, V.T."

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  1. 1

    The reliability of microelectromechanical systems (MEMS) in shock environments by Srikar, V.T., Senturia, S.D.

    Published in Journal of microelectromechanical systems (01-06-2002)
    “…As a first step toward formulating guidelines for the design of dynamically reliable MEMS, we analyze the mechanical response of, and formulate failure…”
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    Journal Article
  2. 2

    Thermoelastic damping in fine-grained polysilicon flexural beam resonators by Srikar, V.T., Senturia, S.D.

    Published in Journal of microelectromechanical systems (01-10-2002)
    “…The design and fabrication of polysilicon flexural beam resonators with very high mechanical quality factors (Q) is essential for many MEMS applications. Based…”
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    Journal Article
  3. 3

    Micro-Raman measurement of bending stresses in micromachined silicon flexures by Srikar, V.T., Swan, A.K., Unlu, M.S., Goldberg, B.B., Spearing, S.M.

    Published in Journal of microelectromechanical systems (01-12-2003)
    “…Micron-scale characterization of mechanical stresses is essential for the successful design and operation of many micromachined devices. Here we report the use…”
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    Journal Article
  4. 4

    Structural design considerations for micromachined solid-oxide fuel cells by Srikar, V.T, Turner, Kevin T, Andrew Ie, Tze Yung, Spearing, S.Mark

    Published in Journal of power sources (01-01-2004)
    “…Micromachined solid-oxide fuel cells (μSOFCs) are among a class of devices being investigated for portable power generation. Optimization of the performance…”
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    Journal Article
  5. 5

    Materials selection in micromechanical design: an application of the Ashby approach by Srikar, V.T., Spearing, S.M.

    Published in Journal of microelectromechanical systems (01-02-2003)
    “…The set of materials available to microsystems designers is rapidly expanding. Techniques now exist to introduce and integrate a large number of metals,…”
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    Journal Article
  6. 6

    Fluidic packaging of microengine and microrocket devices for high-pressure and high-temperature operation by Peles, Y., Srikar, V.T., Harrison, T.S., Protz, C., Mracek, A., Spearing, S.M.

    Published in Journal of microelectromechanical systems (01-02-2004)
    “…The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding…”
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    Journal Article
  7. 7

    Dislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in Al interconnects by Srikar, V.T, Thompson, C.V

    Published in Scripta materialia (17-12-1999)
    “…Interaction of stress-relief induced crystallographic defecs with translating erosion voids to cause a transition to slit-like void shapes has been shown to be…”
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    Journal Article
  8. 8

    Materials selection for microfabricated electrostatic actuators by Srikar, V.T., Spearing, S.M.

    “…Microfabricated electrostatic actuators are employed in a wide variety of microelectromechanical systems (MEMS) for applications ranging from relays and…”
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    Journal Article
  9. 9

    Controlled modification of micromachined silicon surfaces using colloidal micro-and nanoparticles by Srikar, V.T., Peles, Y., Arana, L.R., Spearing, S.M.

    “…We report a processing technique, based on convective self-assembly, to form densely packed, ordered, arrays of colloidal micro-and nanoparticles on the…”
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    Conference Proceeding