Search Results - "Spry, David J."

  • Showing 1 - 19 results of 19
Refine Results
  1. 1

    Demonstration of 4H-SiC Digital Integrated Circuits Above 800 °C by Neudeck, Philip G., Spry, David J., Liangyu Chen, Prokop, Norman F., Krasowski, Michael J.

    Published in IEEE electron device letters (01-08-2017)
    “…Short-term demonstrations of packaged 4H-SiC junction field-effect transistor (JFET) logic integrated circuits (ICs) at temperatures exceeding 800 °C in air…”
    Get full text
    Journal Article
  2. 2

    Extreme temperature 6H-SiC JFET integrated circuit technology by Neudeck, Philip G., Garverick, Steven L., Spry, David J., Chen, Liang-Yu, Beheim, Glenn M., Krasowski, Michael J., Mehregany, Mehran

    “…Extreme temperature semiconductor integrated circuits (ICs) are being developed for use in the hot sections of aircraft engines and other harsh‐environment…”
    Get full text
    Journal Article
  3. 3

    Operational Testing of 4H-SiC JFET ICs for 60 Days Directly Exposed to Venus Surface Atmospheric Conditions by Neudeck, Philip G., Chen, Liangyu, Meredith, Roger D., Lukco, Dorothy, Spry, David J., Nakley, Leah M., Hunter, Gary W.

    “…Prolonged Venus surface missions (lasting months instead of hours) have proven infeasible to date in the absence of a complete suite of electronics able to…”
    Get full text
    Journal Article
  4. 4

    Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect by Spry, David J., Neudeck, Philip G., Liangyu Chen, Lukco, Dorothy, Chang, Carl W., Beheim, Glenn M.

    Published in IEEE electron device letters (01-05-2016)
    “…This letter reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 h of…”
    Get full text
    Journal Article
  5. 5

    Cross-sectional TEM and KOH-Etch Studies of Extended Defects in 3C-SiC p+n Junction Diodes Grown on 4H-SiC Mesas by Speer, Kevin M., Neudeck, Philip G., Spry, David J., Trunek, Andrew J., Pirouz, Pirouz

    Published in Journal of electronic materials (01-05-2008)
    “…This article presents cross-sectional transmission electron microscopy and molten-potassium hydroxide etching studies of (111) 3C-SiC diodes which we…”
    Get full text
    Journal Article
  6. 6

    The Path Towards Realistic ASIC Electronics Deployment Into Previously Impractical Extreme Application Environments by Neudeck, Philip G., Spry, David J., Krasowski, Michael J., Chen, Liangyu

    Published in 2022 Device Research Conference (DRC) (26-06-2022)
    “…Substantial expansion of the practical environmental envelope for integrated circuit (IC) operation offers important benefits to a variety of automotive,…”
    Get full text
    Conference Proceeding
  7. 7

    Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions by Neudeck, Philip G., Meredith, Roger D., Chen, Liangyu, Spry, David J., Nakley, Leah M., Hunter, Gary W.

    Published in AIP advances (01-12-2016)
    “…The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration exploration of the surface of Venus has proven insurmountably…”
    Get full text
    Journal Article
  8. 8
  9. 9

    Experimentally observed electrical durability of 4H-SiC JFET ICs operating from 500 °C to 700 °C by Neudeck, Philip G., Spry, David J., Liangyu Chen, Lukco, Dorothy, Chang, Carl W., Beheim, Glenn M.

    “…Prolonged 500°C to 700°C electrical testing data from 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) are combined with post-testing…”
    Get full text
    Conference Proceeding
  10. 10

    Study of Defect Structures in 6H-SiC a/m-Plane Pseudofiber Crystals Grown by Hot-Wall CVD Epitaxy by Goue, Ouloide Y., Raghothamachar, Balaji, Yang, Yu, Guo, Jianqiu, Dudley, Michael, Kisslinger, Kim, Trunek, Andrew J., Neudeck, Philip G., Spry, David J., Woodworth, Andrew A.

    Published in Journal of electronic materials (01-04-2016)
    “…Structural perfection of silicon carbide (SiC) single crystals is essential to achieve high-performance power devices. A new bulk growth process for SiC…”
    Get full text
    Journal Article
  11. 11

    Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 ^\hbox by Neudeck, P.G., Spry, D.J., Liang-Yu Chen, Beheim, G.M., Okojie, R.S., Chang, C.W., Meredith, R.D., Ferrier, T.L., Evans, L.J., Krasowski, M.J., Prokop, N.F.

    Published in IEEE electron device letters (01-05-2008)
    “…The fabrication and testing of the first semiconductor transistors and small-scale integrated circuits (ICs) to achieve up to 3000 h of stable electrical…”
    Get full text
    Journal Article
  12. 12

    Study of defect structures in 6H-SiC a/m-plane pseudofiber crystals grown by hot-wall CVD epitaxy by Goue, Ouloide Y., Raghothamachar, Balaji, Yang, Yu, Guo, Jianqiu, Dudley, Michael, Kisslinger, Kim, Trunek, Andrew J., Neudeck, Philip G., Spry, David J., Woodworth, Andrew A.

    Published in Journal of electronic materials (25-11-2015)
    “…Structural perfection of silicon carbide (SiC) single crystals is essential to achieve high-performance power devices. A new bulk growth process for SiC…”
    Get full text
    Journal Article
  13. 13

    Prolonged silicon carbide integrated circuit operation in Venus surfaceatmospheric conditions by Neudeck, Philip G, Meredith, Roger D, Chen, Liangyu, Spry, David J, Nakley, Leah M, Hunter, Gary W

    Published in AIP advances (01-12-2016)
    “…The prolonged operation of semiconductor integrated circuits(ICs) needed forlong-duration exploration of the surface of Venus has proven insurmountably…”
    Get full text
    Journal Article
  14. 14

    Cross-sectional TEM and KOH-Etch Studies of Extended Defects in 3C-SiC p^sup +^n Junction Diodes Grown on 4H-SiC Mesas by Speer, Kevin M, Neudeck, Philip G, Spry, David J, Trunek, Andrew J, Pirouz, Pirouz

    Published in Journal of electronic materials (01-05-2008)
    “…This article presents cross-sectional transmission electron microscopy and molten-potassium hydroxide etching studies of (111) 3C-SiC diodes which we…”
    Get full text
    Journal Article
  15. 15
  16. 16

    Aluminum Scandium Nitride as a Functional Material at 1000{\deg}C by Gaddam, Venkateswarlu, Dabas, Shaurya S, Gao, Jinghan, Spry, David J, Baucom, Garrett, Rudawski, Nicholas G, Yin, Tete, Angerhofer, Ethan, Neudeck, Philip G, Kim, Honggyu, Feng, Philip X. -L, Sheplak, Mark, Tabrizian, Roozbeh

    Published 22-10-2024
    “…Aluminum scandium nitride (AlScN) has emerged as a highly promising material for high-temperature applications due to its robust piezoelectric, ferroelectric,…”
    Get full text
    Journal Article
  17. 17

    A High Frequency (HF) inductive power transfer circuit for high temperature applications using SiC Schottky diodes by Jordan, Jennifer L., Ponchak, George E., Spry, David J., Neudeck, Philip G.

    “…Wireless sensors placed in high temperature environments, such as aircraft engines, are desirable to reduce the mass and complexity of routing wires. While…”
    Get full text
    Conference Proceeding
  18. 18

    Novel High Temperature Capacitive Pressure Sensor Utilizing SiC Integrated Circuit Twin Ring Oscillators by Scardelletti, Maximilian C., Neudeck, Philip G., Spry, David J., Meredith, Roger D., Jordan, Jennifer L., Prokop, Norman F., Krasowski, Michael J., Beheim, Glenn M., Hunter, Gary W.

    “…This paper describes initial development and testing of a novel high temperature capacitive pressure sensor system. The pressure sensor system consists of two…”
    Get full text
    Conference Proceeding
  19. 19

    Novel light-emitting devices based on pyridine-containing conjugated polymers by Wang, Y.Z., Gebler, D.D., Spry, D.J., Fu, D.K., Swager, T.M., MacDiamid, A.G., Epstein, A.J.

    Published in IEEE transactions on electron devices (01-08-1997)
    “…We present novel light-emitting devices based on several pyridine-containing conjugated polymers and copolymers in various device configurations. The high…”
    Get full text
    Journal Article