Search Results - "Speidell, J. L."

Liquid Crystal Alignment on Carbonaceous Surfaces with Orientational Order by Stöhr, J., Samant, M. G., Lüning, J., Callegari, A. C., Chaudhari, P., Doyle, J. P., Lacey, J. A., Lien, S. A., Purushothaman, S., Speidell, J. L.

“…We used near-edge x-ray absorption fine structure (NEXAFS) spectroscopy to link the orientational bond order at three carbonaceous surfaces-rubbed polyimide,…”
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Electron and hole mobility enhancement in strained SOI by wafer bonding by Lijuan Huang, Chu, J.O., Goma, S.A., D'Emic, C.P., Koester, S.J., Canaperi, D.F., Mooney, P.M., Cordes, S.A., Speidell, J.L., Anderson, R.M., Wong, H.-S.P.

“…N- and p-MOSFETs have been fabricated in strained Si-on-SiGe-on-insulator (SSOI) with high (15-25%) Ge content. Wafer bonding and H-induced layer transfer…”
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Passive laser-fiber alignment by index method by Cohen, M.S., Cina, M.F., Bassous, E., Oprysko, M.M., Speidell, J.L.

“…A method for packaging a laser-fiber module was explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e., with…”
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A novel scanning tunneling microscope controlled field emission microlens electron source by McCord, M. A., Chang, T. H. P., Kern, D. P., Speidell, J. L.

“…A field emission electron source that combines scanning tunneling microscope (STM) technology with a micromachined aperture has been explored. The STM is used…”
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Lithographically fabricated fiber guides for optical subassemblies by Cohen, M.S., Cordes, M.J., Cordes, S.A., Gelorme, J.D., Kuchta, D.M., Lacey, D.L., Rosner, J., Speidell, J.L.

“…A new optoelectronic packaging technology is presented which permits highly accurate fiber-to-chip alignment at low cost. Instead of the more common methods…”
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Atomic Beam Alignment of Liquid Crystals by Chaudhari, Praveen, Lacey, James A., Lien, Shui-Chih Alan, Speidell, James L.

“…We have found that liquid crystals can be aligned on a polyimide surface exposed to a low energy and neutral argon ion beam. The energy of the incident ions…”
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Packaging of high-density fiber/laser modules using passive alignement techniques by COHEN, M. S, CINA, M. F, BASSOUS, E, OPYRSKO, M. M, SPEIDELL, J. L, CANORA, F. J, DEFRANZA, M. J

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Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding by Huang, L.-J., Chu, J.O., Goma, S., D'Emic, C.P., Koester, S.J., Canaperi, D.F., Mooney, P.M., Cordes, S.A., Speidell, J.L., Anderson, R.M., Wong, H.-S.P.

“…N- and p-MOSFETs have been fabricated in strained Si on SiGe on insulator (SSOI) with high (15-25%) Ge content. Wafer bonding and H-induced layer transfer…”
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Packaging of high density fiber/laser modules using passive alignment techniques by Cohen, M.S., Cina, M.F., Bassous, E., Opyrsko, M.M., Speidell, J.L., Canora, F.J., DeFranza, M.J.

“…A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a…”
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Packaging of high-density fiber/laser modules using passive alignment techniques by Cohen, M.S., Cina, M.F., Bassous, E., Oprysko, M.M., Speidell, J.L., Canora, F.J., Defranza, M.J.

“…A novel method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e.,…”
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