Search Results - "Spalik, J"

Polyimide/Cr/Cu in the presence of chloride ions by Katnani, A. D., Spalik, J., Rands, B., Baldwin, J.

“…Chloride residues, elevated temperature, and humidity affect circuit line adhesion to dielectric material in electronic packaging. Effects of the above…”
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Quantitative determination of ppb levels of carbamate pesticides in water by capillary gas chromatography by Zhong, W Z, Lemley, A T, Spalik, J

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Complementary scanning tunneling microscopy and scanning electron microscopy studies of electroplated gold surfaces by Siperko, L. M., Hurban, S. S., Spalik, J. M., Katnani, A. D.

“…The surface topography of gold electroplated as a function of current density has been studied by two topographical imaging techniques. Scanning tunneling…”
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Complementary scanning tunneling microscopy and scanniong electron microscopy studies of electroplated gold surfaces by SIPERKO, L. M, HURBAN, S. S, SPALIK, J. M, KATNANI, A. D

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