Search Results - "Soucy, J.W."

Design and characterization of wirebonds for use in high shock environments by Marinis, T.F., Soucy, J.W.

“…MEMS inertial sensors, packaged in hermetic chip carriers, utilize free standing wirebonds to connect to the package I/O pads. Considerable care is taken in…”
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Development of packaging for MEMS inertial sensors by Pryputniewicz, R.J., Marinis, T.F., Soucy, J.W., Furlong, C.

“…Development of MEMS inertial sensors and their packaging for high performance applications requires a balanced approach combining analyses with testing and…”
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Vacuum sealed MEMS package with an optical window by Marinis, T.F., Soucy, J.W., Lawrence, J.G., Marinis, R.T., Pryputniewicz, R.J.

“…A vacuum sealed package with an optical window is a useful diagnostic tool for MEMS devices as well as a critical component of optical devices, such as imaging…”
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Isolation of MEMS devices from package stresses by use of compliant metal interposers by Marinis, T.F., Soucy, J.W., Hanson, D.S.

“…Many classes of MEMS devices, such as those with resonant structures, capacitive readouts, and diaphragm elements, are sensitive to stresses that are exerted…”
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Wafer level vacuum packaging of MEMS sensors by Marinis, T.F., Soucy, J.W., Lawrence, J.G., Owens, M.M.

“…A process has been developed for wafer level vacuum packaging MEMS sensors, which are fabricated from etched, single crystal silicon structures, anodically…”
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Time-Lapse Measurements of Stress Relaxation in MEMS Sensor Die Bonds by Marinis, T.F., Soucy, J.W., Marinis, R.T., Klempner, A.R., Hefti, P., Pryputniewicz, R.J.

“…Thermal compression gold bumps have been used to attach high-precision MEMS inertial sensors within hermetic ceramic packages. The bonds can be made at…”
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Gold bump attachment-of MEM sensor die using thermocompression bonding by Marinis, T.F., Soucy, J.W.

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