Search Results - "Sorsch, T"

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  1. 1

    The electronic structure at the atomic scale of ultrathin gate oxides by Muller, D. A, Sorsch, T, Moccio, S, Baumann, F. H, Evans-Lutterodt, K, Timp, G

    Published in Nature (London) (24-06-1999)
    “…The narrowest feature on present-day integrated circuits is the gate oxide-the thin dielectric layer that forms the basis of field-effect device structures…”
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    Journal Article
  2. 2

    Multi-component high- K gate dielectrics for the silicon industry by Manchanda, L, Morris, M.D, Green, M.L, van Dover, R.B, Klemens, F, Sorsch, T.W, Silverman, P.J, Wilk, G, Busch, B, Aravamudhan, S

    Published in Microelectronic engineering (01-11-2001)
    “…The exponential growth of the silicon industry can be attributed to that fact that silicon has a native oxide that is silicon dioxide. With SiO 2 soon…”
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    Journal Article Conference Proceeding
  3. 3

    Tunneling into interface states as reliability monitor for ultrathin oxides by Ghetti, A., Sangiorgi, E., Bude, J., Sorsch, T.W., Weber, G.

    Published in IEEE transactions on electron devices (01-12-2000)
    “…This paper reports experimental data and simulations of low-voltage tunneling in ultrathin oxide MOS devices. When the substrate is very heavily doped, a…”
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    Journal Article
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    Flexible fabrication of large pixel count piston-tip-tilt mirror arrays for fast spatial light modulators by Pardo, Flavio, Cirelli, R.A., Ferry, E.J., Lai, W.Y.-C., Klemens, F.P., Miner, J.F., Pai, C.S., Bower, J.E., Mansfield, W.M., Kornblit, A., Sorsch, T.W., Taylor, J.A., Baker, M.R., Fullowan, R., Simon, M.E., Aksyuk, V.A., Ryf, R., Dyson, H., Arney, S.

    Published in Microelectronic engineering (01-05-2007)
    “…We present arrays of electrostatically actuated piston-tip-tilt micromirrors realized using a surface micromachining 3-structural-layer polysilicon process…”
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    Journal Article Conference Proceeding
  7. 7

    Beyond the gene chip by Heng, Jiunn Benjamin, Aksimentiev, Aleksei, Ho, Chuen, Dimitrov, Valentin, Sorsch, Thomas W., Miner, John F., Mansfield, William M., Schulten, Klaus, Timp, Gregory

    Published in Bell Labs technical journal (2005)
    “…We describe a prospective strategy for reading the encyclopedic information encoded in the genome: using a nanopore in a membrane formed from a metal-oxide…”
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    Journal Article
  8. 8

    Rapid thermal processing of silicon wafers with emissivity patterns by RABUS, M, FIORY, A. T, MANSFIELD, W, RAVINDRA, N. M, FRISELLA, P, AGARWAL, A, SORSCH, T, MINER, J, FERRY, E, KLEMENS, F, CIRELLI, R

    Published in Journal of electronic materials (01-05-2006)
    “…Fabrication of devices and circuits on silicon wafers creates patterns in optical properties, particularly the thermal emissivity and absorptivity, that lead…”
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    Journal Article
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    The role of native traps on the tunneling characteristics of ultra-thin (1.5–3 nm) oxides by Ghetti, A., Sangiorgi, E., Sorsch, T.W., Kizilyalli, I.

    Published in Microelectronic engineering (1999)
    “…In this paper we report experiments and simulations on thin oxide (1.5–3 nm) MOS devices, showing that native traps can play a dominant role in the tunneling…”
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    Journal Article Conference Proceeding
  11. 11

    Ultra-thin gate oxide reliability projections by Weir, B.E., Alam, M.A., Silverman, P.J., Baumann, F., Monroe, D., Bude, J.D., Timp, G.L., Hamad, A., Ma, Y., Brown, M.M., Hwang, D., Sorsch, T.W., Ghetti, A., Wilk, G.D.

    Published in Solid-state electronics (01-03-2002)
    “…We describe the reliability projection methods currently used and show that 1.6 nm oxides are sufficiently reliable even if soft breakdown is considered the…”
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    Journal Article
  12. 12

    Oxidation of Si beneath thin SiO2 layers during exposure to HBr/O2 plasmas, investigated by vacuum transfer x-ray photoelectron spectroscopy by Donnelly, V. M., Klemens, F. P., Sorsch, T. W., Timp, G. L., Baumann, F. H.

    Published in Applied physics letters (01-03-1999)
    “…Thin SiO2 layers were exposed to an HBr/O2 plasma for a variety of short periods, reproducing the over-etching process after polycrystalline Si gate electrodes…”
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    Journal Article
  13. 13

    Monolithic fringe-field-activated crystalline silicon tilting-mirror devices by Greywall, D.S., Chien-Shing Pai, Sang-Hyun Oh, Chorng-Ping Chang, Marom, D.M., Busch, P.A., Cirelli, R.A., Taylor, J.A., Klemens, F.P., Sorsch, T.W., Bower, J.E., Lai, W.Y.-C., Soh, H.T.

    Published in Journal of microelectromechanical systems (01-10-2003)
    “…A new approach is presented for fabricating monolithic crystalline silicon tilting-mirror microoptoelectromechanical systems (MOEMS) devices. The activation…”
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    Journal Article
  14. 14

    The relentless march of the MOSFET gate oxide thickness to zero by Timp, G, Bude, J, Baumann, F, Bourdelle, K.K, Boone, T, Garno, J, Ghetti, A, Green, M, Gossmann, H, Kim, Y, Kleiman, R, Kornblit, A, Klemens, F, Moccio, S, Muller, D, Rosamilia, J, Silverman, P, Sorsch, T, Timp, W, Tennant, D, Tung, R, Weir, B

    Published in Microelectronics and reliability (01-04-2000)
    “…The narrowest feature of an integrated circuit is the silicon dioxide gate dielectric (3–5 nm). The viability of future CMOS technology is contingent upon…”
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    Journal Article
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    Progress toward a 30 nm silicon metal–oxide–semiconductor gate technology by Tennant, D. M., Timp, G. L., Ocola, L. E., Green, M., Sorsch, T., Kornblit, A., Klemens, F., Kleiman, R., Kim, Y., Timp, W.

    “…We report on progress toward scaling both N-metal–oxide–semiconductor (MOS) and P-metal–oxide–semiconductor MOS transistors to a gate length of 30 nm. We…”
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    Conference Proceeding
  16. 16

    COM2 enhanced graded base SiGe technology for high speed applications by Ivanov, T., Shive, S., Esry, T., Lee, C., Johnson, R., Sorsch, T., Banoo, K., Smith, P., Carroll, M., Moinian, S., Mastrapasqua, M., Frei, A., Chen, A., King, C., Hamad, A., Martin, E.

    “…The COM2 enhanced graded base SiGe modular BiCMOS technology has been developed. It is based on the COM2 digital CMOS process. The technology achieves peak…”
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    Conference Proceeding Journal Article
  17. 17

    COM2 enhanced graded base SiGe technology for high speed applications by Ivanov, T., Shive, S., Esry, T., Lee, C., Johnson, R., Sorsch, T., Banoo, K., Smith, P., Cochran, W., Carroll, M., Moinian, S., Mastrapasqua, M., Frei, A., Chen, A., King, C., Hamad, A., Martin, E.

    “…The COM2 Enhanced Graded Base SiGe modular BiCMOS technology has been developed. It is based on the COM2 digital CMOS process. The technology achieves peak…”
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    Conference Proceeding
  18. 18

    High-Density Solder Bump Interconnect for MEMS Hybrid Integration by Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J., Klemens, F., Lai, W., Low Yee, Mansfield, W., Chien-Shing Pai, Papazian, R., Pardo, F., Sorsch, T., Watson, P.

    Published in IEEE transactions on advanced packaging (01-11-2007)
    “…An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The…”
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    Journal Article
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    Monolithic MEMS optical switch with amplified out-of-plane angular motion by Lopez, D., Simon, M.E., Pardo, F., Aksyuk, V., Klemens, F., Cirelli, R., Neilson, D.T., Shea, H., Sorsch, T., Ferry, E., Nalamasu, O., Gammel, P.L.

    “…We describe an array of electrostatically actuated surface micromachined mirrors for fiber-optic switching. Using a pure flexure angle amplification mechanism…”
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    Conference Proceeding