Search Results - "Song, Z.X."
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Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films
Published in Journal of materials science & technology (2010)“…Tungsten (W) thin films were prepared by magnetron sputtering onto Si (100) substrates. Their microstructures were characterized by X-ray diffraction (XRD),…”
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The effect of ZrSiN diffusion barrier on the bonding strength of titanium porcelain
Published in Surface & coatings technology (01-02-2007)“…ZrSiN film was selected as diffusion barrier of titanium porcelain interface and sputtered on polished titanium substrate with RF reactive magnetron…”
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Journal Article Conference Proceeding -
3
The effect of N2 partial pressure on the properties of Nb-Si-N films by RF reactive magnetron sputtering
Published in Surface & coatings technology (01-02-2007)“…Nb-Si-N films were sputtered by RF reactive magnetron sputtering with various N2 partial pressure in argon and nitrogen gas mixture. The characterizers of…”
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Conference Proceeding Journal Article -
4
Theoretical design and experimental study of the interlayer of Al/Mg bimetallic composite plate by solid-liquid cast rolling
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (17-02-2022)“…In this study, to enhance the bonding strength of a solid-liquid cast rolled 6061 Al/AZ31B Mg bimetallic composite plate, an arc-sprayed Zn composite…”
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5
Thermal stability of ultra thin Zr-B-N films as diffusion barrier between Cu and Si
Published in Applied surface science (15-10-2020)“…Cross-sectional HRTEM micrographs of the Cu/Zr-B-N/Si stacks annealed at (a) 600 °C and (b) 650 °C. [Display omitted] •Ultra-thin amorphous Zr-B-N films 5 nm…”
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6
Numerical investigation of the effect of CMAS deposition on the temperature and stress distribution of thermal barrier coatings coated on a turbine blade
Published in Aerospace science and technology (01-09-2023)“…Particle deposition can cause significant damage to thermal barrier coatings (TBCs) and it is critical to understand the deposition characteristics and the…”
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7
Effect of heat treatment variations on the microstructure evolution and mechanical properties in a β metastable Ti alloy
Published in Journal of alloys and compounds (05-11-2016)“…A β metastable titanium alloy Ti5Al4Zr4Mo2Cr2Sn1Fe with an initial duplex structure was thermally treated to produce a wide range of microstructure. The effect…”
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Thermal annealing induced mazy structure on MoO3 thin films and their high sensing performance to NO gas at room temperature
Published in Ceramics international (01-12-2016)“…MoS2 thin films were prepared by radio frequency (RF) magnetron sputtering and then annealed in air. X-ray diffraction (XRD), field-emission electron scanning…”
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9
Ultrathin ZrBxOy films as diffusion barriers in Cu interconnects
Published in Vacuum (01-09-2015)“…Ultra-thin ZrBxOy films 5 nm in thickness were prepared by radio-frequency (rf) magnetron sputtering. The thermal stability and the barrier performance against…”
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10
SAR Observation Error Estimation Based on Maximum Relative Projection Matching
Published in International journal of antennas and propagation (2020)“…The existing sparse imaging observation error estimation methods are to usually estimate the error of each observation position by substituting the error…”
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Thermal stability of RuZr alloy thin films as the diffusion barrier in Cu metallization
Published in Journal of alloys and compounds (05-03-2014)“…•The crystallization of Ru thin films can be suppressed by Zr doping.•Amorphous RuZr thin films were fabricated by magnetron sputtering.•It could be used to…”
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Interface stability and microstructure of an ultrathin α-Ta/graded Ta(N)/TaN multilayer diffusion barrier
Published in Microelectronic engineering (01-10-2012)“…An ultrathin α-Ta (5nm)/graded Ta(N) (1.5nm)/TaN (2.5nm) multilayer film covered by Cu film was deposited on the Si substrate using reactive magnetron…”
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13
WITHDRAWN: Crystalline orientation and surface structure anisotropy of annealed thin tungsten films
Published in Surface & coatings technology (01-08-2006)Get full text
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14
Microstructure, formation mechanism and compression plasticity of regularly faceted Cu particles
Published in Scripta materialia (01-03-2009)“…Regular submicron-scale Cu particles formed spontaneously by annealing Cu–Zr films. Based on these experimental results, it was speculated that these Cu…”
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Stress relaxation induced faceted Cu and W particles on the surfaces of Cu–Zr and W thin films
Published in Applied surface science (30-08-2009)“…Faceted copper and tungsten particles in submicron-scale were obtained by annealing copper–zirconium thin films on polyimide (PI) substrates as well as in the…”
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16
The effect of N 2 partial pressure on the properties of Nb–Si–N films by RF reactive magnetron sputtering
Published in Surface & coatings technology (26-02-2007)“…Nb–Si–N films were sputtered by RF reactive magnetron sputtering with various N 2 partial pressure in argon and nitrogen gas mixture. The characterizers of…”
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17
The self-formation graded diffusion barrier of Zr/ZrN
Published in Microelectronic engineering (01-03-2010)“…In this paper, the 5 nm ZrN diffusion barrier was deposited by high vacuum magnetron sputtering method on Si substrate and the 300 nm Cu(Zr) alloy film or Cu…”
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Journal Article Conference Proceeding -
18
The characterization of Zr–Si–N diffusion barrier films with different sputtering bias voltage
Published in Thin solid films (01-12-2004)“…Zr–Si–N diffusion barriers were sputtered by RF reactive magnetron sputtering with different bias voltage. The Cu films were subsequently sputtered onto the…”
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19
Crystalline orientation and surface structure anisotropy of annealed thin tungsten films
Published in Surface & coatings technology (26-02-2007)“…The correlation between texture coefficient T 110 and surface structure anisotropy of thin metal film is constructed with an approach of integrating the…”
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Journal Article Conference Proceeding -
20
The Effect of nitrogen partial pressure on Zr–Si–N diffusion barrier
Published in Microelectronic engineering (2004)“…The Zr–Si–N diffusion barrier was sputtered on Si wafer with different nitrogen partial pressures by RF reactive magnetron sputtering. The Cu film was…”
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