Search Results - "Son, Jae Yeol"

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish by Jeong, Haksan, Lee, Choong-Jae, Min, Kyung Deuk, Son, Jae-yeol, Jung, Seung-Boo

“…The development of ball grid array (BGA) packages, such as the chip scale package, wafer level package and package on package, has focused on creating…”
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Electromigration Behavior of Cu Core Solder Joints Under High Current Density by Jeong, Haksan, Lee, Choong-Jae, Kim, Jae-Ha, Son, Jae-yeol, Jung, Seung-Boo

“…Cu core solder ball (CCSB) is formed by a Cu core surrounded by solder alloy and is used as an interconnection material for 3D packaging. Herein, the…”
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Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board by Son, Jae-yeol, Kang, Donggil, Jeong, Haksan, Jung, Seung-Boo

“…The interfacial reaction and the mechanical properties of the Cu core solder balls (CCSB) assembled on the organic solderability preservative (OSP) surface…”
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Breakup behavior of a molten metal jet by Oh, Yong Suk, Choi, Dong Yun, Son, Jae Yeol, Kim, Bo Young, Kang, Hyun Wook, Chang, Cheong Bong, Moon, Jeong-Tak, Sung, Hyung Jin

“…•Breakup behavior of a molten metal jet into a still gas is numerically studied.•Droplet formation by imposing a sinusoidal waveform perturbation.•Effect of…”
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Generalized Polynomial Guidance for Terminal Velocity Control of Tactical Ballistic Missiles by Moon, Gun-Hee, Tahk, Min-Jea, Han, Du Hee, Son, JaeYeol

“…This paper proposes generalized polynomial guidance for controlling the terminal velocity vector (speed and flight path angle), which could be critical for the…”
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