Search Results - "Son, Injoon"
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Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification
Published in Applied surface science (15-04-2021)“…The ENEPIG-plated BiTe-based thermoelectric modules exhibited the highest bonding strengths of over 11 MPa, which is approximately 2 and 1.5 times higher than…”
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Self-Propagating Heat Synthetic Reactivity of Fine Aluminum Particles via Spontaneously Coated Nickel Layer
Published in Scientific reports (31-01-2019)“…Aluminum powders are known to provide outstanding volumetric exothermic enthalpy energy during thermal oxidation. However, the amount of energy released tends…”
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Effect of Reaction Product of Epichlorohydrin and Imidazole on the Electrodeposition Behavior of Zn–Ni Alloy from Alkaline Zincate Solution
Published in ISIJ International (15-08-2021)“…A Zn–Ni alloy was electrodeposited on a Cu electrode at a current density of 10–5000 A·m−2, a charge of 5 × 104 C·m−2, and temperature of 293 K in an…”
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Corrosion Resistance of Zn–Ni Alloy Films Electroplated in Alkaline Zincate Solutions Containing a Brightener
Published in ISIJ International (15-11-2023)“…Zn–Ni alloys were electroplated on a Fe plate with a thickness of 40 µm at 500 A·m−2 and 293 K in unagitated zincate solutions. The reaction product of…”
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Effect of Solution Temperature on Electrodeposition Behavior of Zn–Ni Alloy from Alkaline Zincate Solution
Published in ISIJ International (15-07-2022)“…Zn–Ni alloys were electrodeposited on a Cu electrode at 10–500 A·m−2 and 5 × 104 C·m−2 in an unagitated zincate solution at 293, 313, and 333 K. The effect of…”
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Synergistic Effect of Brightener and Solution Temperature on the Electrodeposition Behavior of Zn–Ni Alloy from Alkaline Zincate Solution
Published in ISIJ International (15-09-2022)“…Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5000 A·m−2, 5 × 104 C·m−2, 293 K, 313 K, and 333 K in unagitated zincate solutions containing the…”
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Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements
Published in Archives of metallurgy and materials (01-01-2021)“…To improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal…”
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Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
Published in Archives of metallurgy and materials (01-01-2021)“…The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys…”
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Enhanced Energetic Performance of Polyvinylidene Fluoride-Coated Zirconium Particle
Published in Archives of metallurgy and materials (01-01-2021)“…In this study, energetic behaviors of polyvinylidene fluoride (PVDF)-coated zirconium (Zr) powders were investigated using thermogravimetric…”
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Degreasing Efficiency of Electroplating Pretreatment Process Using Secondary Alcohol Ethoxylate as Nonionic Surfactant
Published in Applied sciences (01-11-2022)“…In this study, the effect of the hydrophilic–lipophilic balance (HLB) number and cloud point (CP) of a secondary-alcohol ethoxylated nonionic surfactant on…”
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Characterization of Copper–Graphite Composites Fabricated via Electrochemical Deposition and Spark Plasma Sintering
Published in Applied sciences (01-07-2019)“…In the present study, we have demonstrated a facile and robust way for the fabrication of Cu-graphite composites (CGCs) with spatially-aligned graphite layers…”
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Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements
Published in Archives of metallurgy and materials (01-01-2019)“…In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was…”
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Heat Treatment Effect on Physical Properties of Stainless Steel / Inconel Bonded by Directed Energy Deposition
Published in Archives of metallurgy and materials (01-01-2021)“…In this study, stainless steel 316L and Inconel 625 alloy powders were additively manufactured by using directed energy deposition process. And heat treatment…”
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전자부품 커넥터의 접속 신뢰성 향상을 위한 Au-Sn 합금 도금층 연구
Published in Biuletyn Uniejowski (2022)Get full text
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전착법으로 제작한 Ni(OH)₂ 나노 시트의 핵 형성과 성장 거동에 미치는 헥사-메틸렌테트라민(HMT)의 영향
Published in Biuletyn Uniejowski (2021)Get full text
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전착법에 의해 제작된 Ni(OH)₂ 나노 시트의 표면 관찰 및 분석
Published in Biuletyn Uniejowski (2021)Get full text
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Thermomechanical stability of Bi2Te3-based thermoelectric modules employing variant diffusion barriers
Published in Intermetallics (01-01-2022)“…An electroless nickel (EN) layer and EN, along with electroless palladium (EP), and immersion gold (IG) (ENEPIG) multilayers were two variant diffusion…”
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