Crystal Structure of Cu-Sn-In Alloys Around the η-Phase Field Studied by Neutron Diffraction

Crystal Structure of Cu-Sn-In Alloys Around the η-Phase Field Studied by Neutron Diffraction

Study of the Cu-Sn-In ternary system has become quite important in recent years, due to new environmental regulations increasingly restricting use of Pb for bonding technologies in electronic devices. A key relevant issue concerns the intermetallic phases which grow in the bonding zone and strongly...

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Bibliographic Details
Published in:Journal of electronic materials Vol. 41; no. 11; pp. 3223 - 3231
Main Authors: Aurelio, G., Sommadossi, S.A., Cuello, G.J.
Format: Journal Article
Language:English
Published: Boston Springer US 01-11-2012
Springer
Subjects:
Alloys
BONDING
Characterization and Evaluation of Materials
Chemistry and Materials Science
Condensed matter: structure, mechanical and thermal properties
Constitution
Copper
COPPER TIN ALLOYS
CRYSTAL STRUCTURE
Electron probes
Electronics and Microelectronics
Exact sciences and technology
Instrumentation
INTERMETALLIC COMPOUNDS
Materials Science
NEUTRON DIFFRACTION
Neutron diffraction and scattering
Optical and Electronic Materials
PHASES
Physics
QUENCHING MECHANISMS
SCANNING ELECTRON MICROSCOPY
Single-crystal and powder diffraction
Solid State Physics
Structure of solids and liquids; crystallography
Structure of specific crystalline solids
TERNARY PHASE DIAGRAMS
Ternary systems
neutron diffraction
Cu-Sn alloys
Pb-free solders
Scanning electron microscopy
Rietveld method
Intermetallic compounds
Scanning probe microscopy
Neutron diffraction
Ternary systems
Ternary alloys
Theoretical study
Crystallography
Tin alloys
Hexagonal lattices
Electron microprobe analysis
Copper alloys
Lead free solder
Modelling
Crystal structure
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Summary:Study of the Cu-Sn-In ternary system has become quite important in recent years, due to new environmental regulations increasingly restricting use of Pb for bonding technologies in electronic devices. A key relevant issue concerns the intermetallic phases which grow in the bonding zone and strongly affect its quality and performance. In this work, we focus on the η-phase (Cu 2 In or Cu 6 Sn 5 ) that exists in both end binaries and as a ternary phase. We present a neutron diffraction study of the constitution and crystallography of a series of alloys around the 60 at.% Cu composition, and with In contents ranging from 0 at.% to 25 at.%, quenched from 300°C. The alloys were characterized by scanning electron microscopy (SEM), electron probe microanalysis (EPMA), and high-resolution neutron diffraction (ND). Rietveld refinement of ND data allowed improvement of the currently available model for site occupancies in the hexagonal η-phase in the binary Cu-Sn as well as in ternary alloys. For the first time, structural data are reported for the ternary Cu-Sn-In η-phase as a function of composition, information that is of fundamental technological importance as well as valuable for ongoing modeling of the ternary phase diagram.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-012-2193-4