Application of ICP-MS to identify the source of Metallic Contamination

Application of ICP-MS to identify the source of Metallic Contamination

Inductively Coupled Plasma Mass Spectrometry (ICP-MS) is being widely used in semiconductor industry to analyze the metallic contents of chemicals used in the wafer fabrication process. In this paper, application of ICP-MS to identify the types and source of metallic contaminations in solvents used...

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Bibliographic Details
Published in:2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) pp. 1 - 5
Main Authors: Neo, S.P., Yeo, W.T., Loh, C.W., Zaw, R., Suazo, V.J., Nilesh, J., Sohn, I.J., Rao, Ramesh, Mo, Z.Q.
Format: Conference Proceeding
Language:English
Published: IEEE 15-07-2024
Subjects:
Chemicals
Contamination
Electronics industry
Fabrication
Failure analysis
ICP-MS
Integrated circuits
Lithography
Mass spectroscopy
Plasmas
Resist reduction consumption
Solvents
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Summary:Inductively Coupled Plasma Mass Spectrometry (ICP-MS) is being widely used in semiconductor industry to analyze the metallic contents of chemicals used in the wafer fabrication process. In this paper, application of ICP-MS to identify the types and source of metallic contaminations in solvents used in the lithography step, which subsequently translated to become particles affecting the lithography process and causing the wafers to fail was discussed. Two case studies were presented in this paper.
ISSN:1946-1550
DOI:10.1109/IPFA61654.2024.10691035