Search Results - "Snugovsky, P."

Whisker Formation on SAC305 Soldered Assemblies by Meschter, S., Snugovsky, P., Bagheri, Z., Kosiba, E., Romansky, M., Kennedy, J., Snugovsky, L., Perovic, D.

“…This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in…”
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Electroless Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints by Snugovsky, P, Arrowsmith, P, Romansky, M

“…Black Pad was observed on Electroless Ni/Immersion Au (ENIG) wire bond pads. Thick immersion Au on highly corroded electroless Ni was detected. It was…”
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Impact of board and component metallizations on microstructure and reliability of lead-free solder joints by Zbrzezny, A.R., Snugovsky, P., Perovic, D.D.

“…Aging and accelerated thermal cycling (ATC) have been performed on 2512 chip resistors assembled with Sn3.8Ag0.7Cu (wt.%) solder. The boards were finished with…”
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Reliability Investigation of Mixed BGA Assemblies by Zbrzezny, A.R., Snugovsky, P., Lindsay, T., Lau, R.

“…The effect of different reflow profiles on the reliability of lead-free (LF) Sn-3.0 Ag-0.5 Cu (wt.%) (SAC 305) ball grid array (BGA) devices assembled with a…”
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Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate by QI, Y, ZBRZEZNY, A. R, AGIA, M, LAM, R, GHORBANI, H. R, SNUGOVSKY, P, PEROVIC, D. D, SPELT, J. K

“…Leadless chip resistor (LCR) assemblies were manufactured using both traditional tin-lead (Sn37Pb) and lead-free (Sn3.8Ag0.7Cu) solders. The leadfree test…”
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Electroless Ni/Immersion Au interconnects : Investigation of Black Pad in wire bonds and solder joints by SNUGOVSKY, P, ARROWSMITH, P, ROMANSKY, M

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Whisker Formation Induced by Component and Assembly Ionic Contamination by Snugovsky, Polina, Meschter, Stephan, Bagheri, Zohreh, Kosiba, Eva, Romansky, Marianne, Kennedy, Jeffrey

“…This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of…”
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Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints by Qi, Yan, Lam, Rex, Ghorbani, Hamid R., Snugovsky, Polina, Spelt, Jan K.

“…Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. ATC testing decreases life cycle test time…”
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iNEMI Pb-free alloy characterization project report: Thermal fatigue results for low and no-Ag alloys by Henshall, G., Sweatman, K., Howell, K., de Tino, U. M., Miremadi, J., Parker, R., Coyle, R., Smetana, J., Nguyen, J., Weiping Liu, Pandher, R. S., Daily, D., Currie, M., Tae-Kyu Lee, Silk, J., Jones, B., Tisdale, S., Hua, F., Osterman, M., Sack, T., Snugovsky, P., Syed, A., Allen, A., Arnold, J., Moore, D., Chang, G., Benedetto, E.

“…Significant innovations in Pb-free solder alloy formulations are being driven by volume manufacturing and field experiences. As a result, the industry has seen…”
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Addressing opportunities and risks of pb-free solder alloy alternatives by Henshall, G., Healey, R., Pandher, R.S., Sweatman, K., Howell, K., Coyle, R., Sack, T., Snugovsky, P., Tisdale, S., Hua, F., O'Malley, G.

“…Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen…”
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