Search Results - "Slattery, O"

Long-wavelength-pumped upconversion single-photon detector at 1550 nm: performance and noise analysis by Pelc, J S, Ma, L, Phillips, C R, Zhang, Q, Langrock, C, Slattery, O, Tang, X, Fejer, M M

“…We demonstrate upconversion-assisted single-photon detection for the 1.55-μm telecommunications band based on a periodically poled lithium niobate (PPLN)…”
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1310 nm differential-phase-shift QKD system using superconducting single-photon detectors by Ma, Lijun, Nam, S, Xu, Hai, Baek, B, Chang, Tiejun, Slattery, O, Mink, A, Tang, Xiao

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Experimental demonstration of an active quantum key distribution network with over gbps clock synchronization by Lijun Ma, Mink, A., Hai Xu, Slattery, O., Xiao Tang

“…We demonstrate a three-node QKD network that allows multiple users to share secure keys. This QKD network operates on the 850 nm and 1550 nm wavelengths at…”
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Experimental Demonstration of a Detection-Time-Bin-Shift Polarization Encoding Quantum Key Distribution System by Lijun Ma, Tiejun Chang, Mink, A., Slattery, O., Hershman, B., Xiao Tang

“…Detection-time-bin-shift (DTBS) is a scheme that uses time division multiplexing of a single photon detector between two photon bases in a quantum key…”
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Stability Comparison of Recordable Optical Discs-A Study of Error Rates in Harsh Conditions by Slattery, Oliver, Lu, Richang, Zheng, Jian, Byers, Fred, Tang, Xiao

“…The reliability and longevity of any storage medium is a key issue for archivists and preservationists as well as for the creators of important information…”
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The State of the Art and Practice in Digital Preservation by Lee, Kyong-Ho, Slattery, Oliver, Lu, Richang, Tang, Xiao, McCrary, Victor

“…The goal of digital preservation is to ensure long-term access to digitally stored information. In this paper, we present a survey of techniques used in…”
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Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate by Desmulliez, M.P.Y., Pang, A.J., Leonard, M., Dhariwal, R.S., Yu, W., Abraham, E., Bognar, G., Poppe, A., Horvath, G., Kohari, Z., Rencz, M., Emerson, D.R., Barber, R.W., Slattery, O., Waldron, F., Cordero, N.

“…The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The…”
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Sources of variation in piezoresistive stress sensor measurements by Slattery, O., O'Mahoney, D., Sheehan, E., Waldron, F.

“…Piezoresistive stress sensors are widely used to characterize semiconductor die stresses. Packaging stresses induce a small change in resistance in the sensors…”
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100-km entanglement distribution with coexisting quantum and classical signals in a single fiber by Rahmouni, A., Kuo, P. S., Li-Baboud, Y. S., Burenkov, I. A., Shi, Y., Jabir, M. V., Lal, N., Reddy, D., Merzouki, M., Ma, L., Battou, A., Polyakov, S. V., Slattery, O., Gerrits, T.

“…The development of prototype metropolitan-scale quantum networks is underway and entails transmitting quantum information via single photons through deployed…”
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Predicting thermomechanical stress using MESMERIC methodology by Slattery, O., O'Mahoney, D., Sheehan, E., Waldron, F., McCarthy, G.

“…Packaged ICs are subjected to thermomechanical stress during manufacture and operation. Accurate characterisation of these stresses, which may induce failure,…”
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Methods of analysing thermomechanical stress in plastic packages for integrated circuits by Slattery, O., Hayes, T., Lawton, W., Kelly, G., Lyden, C., Barrett, J., O'Mathuna, C.

“…Thermomechanical stresses are built up in the plastic packages during the manufacture of an integrated device and also throughout the working life of the…”
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Evaluation of Packaging Effect on MEMS Performance: Simulation and Experimental Study by Lishchynska, M., O'Mahony, C., Slattery, O., Wittler, O., Walter, H.

“…The thermal cure required for die attach during microelectro-mechanical systems (MEMS) packaging causes thermal mismatch that induces undesirable stresses and…”
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Extensive electrical and thermal characterization of an MCM-D technology by Lozano, M., Santander, J., Cabruja, E., Collado, A., Ullan, M., Lora-Tamayo, E., Doyle, R., McCarthy, G., Barton, J., Slattery, O.

“…In this paper, it is shown the work carried out on thermal characterization of the main materials employed in the deposited-type multichip module (MCM-D)…”
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Membrane Protein Crystallization in Lipidic Mesophases with Tailored Bilayers by Misquitta, Lisa V., Misquitta, Yohann, Cherezov, Vadim, Slattery, Orla, Mohan, Jakkam M., Hart, David, Zhalnina, Mariya, Cramer, William A., Caffrey, Martin

“…Monoacylglycerols have been used as bilayered hosts for growing crystals of membrane proteins. To date, the lipids used have had chains 16 and 18 carbon atoms…”
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Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment by Rosten, H.I., Parry, J.D., Lasance, C.J.M., Vinke, H., Temmerman, W., Nelemans, W., Assouad, Y., Gautier, T., Slattery, O., Cahill, C., O'Flattery, M., Lacaze, C., Zemlianoy, P.

“…The accurate prediction of the operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack…”
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State of the art in prediction of mechanical behaviour of microsystems [MEMS] by Lishchynska, M., Cordero, N., Slattery, O.

“…Behavioural models as analytical expressions relating loading parameters, material properties, and geometry of the microstructure with its performance…”
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Thermal resistance measurement protocols by O'Flaherty, M., Cahill, C., Rodgers, K., Slattery, O.

“…Thermal data supplied by manufacturers and used as a benchmark in a comparison of the thermal performance of different packages must be treated with caution,…”
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Evaluation of spring constant in plates with straight suspensions by Lishchynska, M., Cordero, N., Slattery, O., O'Mahony, C.

“…The mechanical spring constant is one of the most important characteristics of micromechanical structures, providing a key tool for accurate behavioural…”
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Validation of numerical models of ceramic pin grid array packages by O'Flaherty, M., Cahill, C., Rodgers, K., Slattery, O.

“…Thermal data for devices provided in manufacturers' data sheets are measured under idealized conditions and are not adequate to predict accurately junction…”
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Simulating piezoelectric transformers for lighting applications by Morris, M., Slattery, O., Duffy, G., Byrne, P., Connell, A.

“…Advanced piezoelectric transformer technology is being investigated for lighting applications. This technology is substituting magnetic transformers used in…”
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