Production of Cu/Diamond Composite Coatings and Their Selected Properties

Production of Cu/Diamond Composite Coatings and Their Selected Properties

This article presents Cu/diamond composite coatings produced by electrochemical reduction on steel substrates and a comparison of these coatings with a copper coating without diamond nanoparticles (<10 nm). Deposition was carried out using multicomponent electrolyte solutions at a current density...

Full description

Saved in:
Bibliographic Details
Published in:Materials Vol. 17; no. 12; p. 2803
Main Authors: Cieślak, Grzegorz, Gostomska, Marta, Dąbrowski, Adrian, Skroban, Katarzyna, Ciciszwili-Wyspiańska, Tinatin, Wojda, Edyta, Mazurek, Anna, Głowacki, Michał, Baranowski, Michał, Gajewska-Midziałek, Anna, Trzaska, Maria
Format: Journal Article
Language:English
Published: Switzerland MDPI AG 08-06-2024
MDPI
Subjects:
Chemical reduction
Coatings
Composite materials
Copper
Heat conductivity
Hot pressing
Mechanical properties
Nanoparticles
Nickel
Plating
Powder metallurgy
Protective coatings
Scratch tests
Solder coating
Solderability
Solders
Substrates
Surface roughness
Wettability
Poland
Germany
composite coatings
nanodiamond
copper
solderability
mechanical properties
structure
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This article presents Cu/diamond composite coatings produced by electrochemical reduction on steel substrates and a comparison of these coatings with a copper coating without diamond nanoparticles (<10 nm). Deposition was carried out using multicomponent electrolyte solutions at a current density of 3 A/dm and magnetic stirring speed of 100 rpm. Composite coatings were deposited from baths with different diamond concentrations (4, 6, 8, 10 g/dm ). This study presents the surface morphology and structure of the produced coatings. The surface roughness, coating thickness (XRF), mechanical properties (DSI), and adhesion of coatings to substrates (scratch tests) were also characterized. The coatings were also tested to assess their solderability, including their spreadability, wettability of the solder, durability of solder-coating bonds, and a microstructure study.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1996-1944
1996-1944
DOI:10.3390/ma17122803