Search Results - "Simicic, M."

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  1. 1

    Hydrogen absorption and electrochemical properties of Mg2Ni-type alloys synthesized by mechanical alloying by SIMICIC, M. V, ZDUJIC, M, DIMITRIJEVIC, R, NIKOLIC-BUJANOVIC, Lj, POPOVIC, N. H

    Published in Journal of power sources (01-07-2006)
    “…Mg2Ni-type alloys, i.e., Mg2Ni, Mg2Ni0.75Cu0.25, Mg2Ni0.6Cu0.4 and Mg2Ni0.75V0.25 were synthesized by mechanical alloying and subsequent thermal treatment…”
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    Journal Article
  2. 2

    Statistical Characterization of BTI and RTN using Integrated pMOS Arrays by Stampfer, B., Simicic, M., Weckx, P., Abbasi, A., Kaczer, B., Grasser, T., Waltl, M.

    “…To study charge trapping kinetics of oxide and interface defects, BTI and RTN measurements are typically performed. However, characterizing and investigating a…”
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    Conference Proceeding
  3. 3

    Advanced MOSFET variability and reliability characterization array by Simicic, M., Putcha, V., Parvais, B., Weckx, P., Kaczer, B., Groeseneken, G., Gielen, G., Linten, D., Thean, A.

    “…Time-zero variability, bias temperature instability (BTI) and random telegraph noise (RTN) are issues that both analog and digital designers using scaled CMOS…”
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    Conference Proceeding Journal Article
  4. 4

    Characterization and simulation methodology for time-dependent variability in advanced technologies by Weckx, P., Kaczer, B., Raghavan, P., Franco, J., Simicic, M., Roussel, Ph J., Linten, D., Thean, A., Verkest, D., Catthoor, F., Groeseneken, G.

    “…This paper describes the implications of Bias Temperature Instability (BTI) related time-dependent threshold voltage distributions on the performance and yield…”
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    Conference Proceeding
  5. 5

    Comphy — A compact-physics framework for unified modeling of BTI by Rzepa, G., Franco, J., O’Sullivan, B., Subirats, A., Simicic, M., Hellings, G., Weckx, P., Jech, M., Knobloch, T., Waltl, M., Roussel, P.J., Linten, D., Kaczer, B., Grasser, T.

    Published in Microelectronics and reliability (01-06-2018)
    “…Metal-oxide-semiconductor (MOS) devices are affected by generation, transformation, and charging of oxide and interface defects. Despite 50 years of research,…”
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    Journal Article
  6. 6

    A brief overview of gate oxide defect properties and their relation to MOSFET instabilities and device and circuit time-dependent variability by Kaczer, B., Franco, J., Weckx, P., Roussel, Ph.J., Putcha, V., Bury, E., Simicic, M., Chasin, A., Linten, D., Parvais, B., Catthoor, F., Rzepa, G., Waltl, M., Grasser, T.

    Published in Microelectronics and reliability (01-02-2018)
    “…A paradigm for MOSFET instabilities is outlined based on gate oxide traps and the detailed understanding of their properties. A model with trap energy levels…”
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    Journal Article
  7. 7

    Toward 0 V ESD Protection in 2.5D/3D Advanced Bonding Technology by Lin, S.-H., Simicic, M., Pantano, N., Chen, S.-H., Van Der Plas, G., Beyne, E., Wambacq, P.

    “…This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding…”
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    Conference Proceeding
  8. 8

    The defect-centric perspective of device and circuit reliability—From gate oxide defects to circuits by Kaczer, B., Franco, J., Weckx, P., Roussel, Ph.J., Simicic, M., Putcha, V., Bury, E., Cho, M., Degraeve, R., Linten, D., Groeseneken, G., Debacker, P., Parvais, B., Raghavan, P., Catthoor, F., Rzepa, G., Waltl, M., Goes, W., Grasser, T.

    Published in Solid-state electronics (01-11-2016)
    “…As-fabricated (time-zero) variability and mean device aging are nowadays routinely considered in circuit simulations and design. Time-dependent variability…”
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    Journal Article
  9. 9

    External I/O interfaces in sub-5nm GAA NS Technology and STCO Scaling Options by Chen, W.-C., Chen, S.-H., Hellings, G., Bury, E., Simicic, M., Wu, Z., Van der Plas, G., Groeseneken, G., Beyne, E.

    Published in 2021 Symposium on VLSI Technology (13-06-2021)
    “…In this paper, the challenges of the I/O development roadmap are discussed. The impact of I/O application in FEOL scaling and 3D integration are evaluated. A…”
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    Conference Proceeding
  10. 10

    Statistical assessment of the full VG/VD degradation space using dedicated device arrays by Bury, E., Kaczer, B., Chuang, K., Franco, J., Weckx, P., Chasin, A., Simicic, M., Linten, D., Groeseneken, G.

    “…Variability of as-fabricated (i.e., time-zero) parameters of modern VLSI devices has been considered in circuit design tools for some time. Also work on…”
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    Conference Proceeding
  11. 11

    Si/SiGe superlattice I/O finFETs in a vertically-stacked Gate-All-Around horizontal Nanowire Technology by Hellings, G., Mertens, H., Subirats, A., Simoen, E., Schram, T., Ragnarsson, L.-A., Simicic, M., Chen, S.-H., Parvais, B., Boudier, D., Cretu, B., Machillot, J., Pena, V., Sun, S., Yoshida, N., Kim, N., Mocuta, A., Linten, D., Horiguchi, N.

    Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)
    “…This work presents Si/SiGe superlattice finFETs (FF) for 1.8V/2.5V I/O applications in vertically-stacked Gate-All-Around horizontal nanowire technology (hNW)…”
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    Conference Proceeding
  12. 12

    CDM-Time Domain Turn-on Transient of ESD Diodes in Bulk FinFET and GAA NW Technologies by Chen, S.-H., Linten, D., Hellings, G., Simicic, M., Kaczer, B., Chiarella, T., Mertens, H., Mitard, J., Mocuta, A., Horiguchi, N.

    “…Voltage transient overshoot is an essential device characteristic of ESD protection diodes under CDM-like stress. Using 3D TCAD and vfTLP characterization, the…”
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    Conference Proceeding
  13. 13

    Defect-based compact modeling for RTN and BTI variability by Weckx, P., Simicic, M., Nomoto, K., Ono, M., Parvais, B., Kaczer, B., Raghavan, P., Linten, D., Sawada, K., Ammo, H., Yamakawa, S., Spessot, A., Verkest, D., Mocuta, Anda

    “…This paper describes a defect-centric based compact modeling methodology for time-dependent threshold voltage variability (V TH ), induced by Bias Temperature…”
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    Conference Proceeding
  14. 14

    Self-heating-aware CMOS reliability characterization using degradation maps by Bury, E., Chasin, A., Kaczer, B., Chuang, K.-H., Franco, J., Simicic, M., Weckx, P., Linten, D.

    “…Time-dependent variability of modern VLSI devices, due to their associated degradation mechanisms, such as Bias Temperature Instabilities (BTI) and Hot Carrier…”
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    Conference Proceeding
  15. 15

    Scaling CMOS beyond Si FinFET: an analog/RF perspective by Parvais, B., Hellings, G., Simicic, M., Weckx, P., Mitard, J., Jang, D., Deshpande, V., van Liempc, B., Veloso, A., Vandooren, A., Waldron, N., Wambacq, P., Collaert, N., Verkest, D.

    “…FinFET has been introduced in the 22/16nm node to continue CMOS logic scaling. The very tight pitches foreseen for the coming generation necessitate the…”
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    Conference Proceeding
  16. 16

    Benchmarking time-dependent variability of junctionless nanowire FETs by Kaczer, B., Rzepa, G., Franco, J., Weckx, P., Chasin, A., Putcha, V., Bury, E., Simicic, M., Roussel, Ph, Hellings, G., Veloso, A., Matagne, Ph, Grasser, T., Linten, D.

    “…Time-dependent variability of junctionless gate-all-around nanowire pFETs is studied through measurements and simulations. The variability, related to effects…”
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    Conference Proceeding
  17. 17

    A fully-integrated method for RTN parameter extraction by Simicic, M., Morrison, S., Parvais, B., Weckx, P., Kaczer, B., Sawada, K., Ammo, H., Yamakawa, S., Nomoto, K., Ohno, M., Linten, D., Verkest, D., Wambacq, P., Groeseneken, G., Gielen, G.

    Published in 2017 Symposium on VLSI Technology (01-06-2017)
    “…A method for on-chip extraction of random telegraph noise (RTN) parameters from transistors is proposed. Exploiting the nature of exponential distributed RTN…”
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    Conference Proceeding
  18. 18

    Experimental evidences and simulations of trap generation along a percolation path by Gerrer, Louis, Hussin, Razaidi, Amoroso, Salvatore M., Franco, J., Weckx, P., Simicic, M., Horiguchi, N., Kaczer, Ben, Grasser, T., Asenov, Asen

    “…In this paper we present experimental results of single trap impact on bulk MOSFETs, shedding light on counter intuitive behavior when increasing the gate…”
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    Conference Proceeding
  19. 19
  20. 20

    An experimental study of zinc morphology in alkaline electrolyte at low direct and pulsating overpotentials by Simičić, M.V., Popov, K.I., Krstajić, N.V.

    “…A possible mechanism of the formation of spongy zinc electrodeposits is considered. The confirmation of the proposed semiquantitative mathematical model is…”
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    Journal Article