Search Results - "Silomon, Jendrik"
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Micromechanical BEoL robustness evaluation methods enabling loading condition customization and acoustic emission damage monitoring
Published in MethodsX (01-01-2023)“…For micromechanical robustness evaluation methods, it is advantageous if the mechanical loading conditions applied can be controlled as precisely as possible…”
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Journal Article -
2
BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods
Published in Microelectronics and reliability (01-09-2022)“…Under harsh application conditions in fields such as aerospace or automotive, it is crucial that the mechanical robustness of microchip components is ensured…”
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Journal Article -
3
Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography
Published in Microelectronics and reliability (01-06-2021)“…A novel approach is presented to evaluate the mechanical stability of back end of line (BEoL) stacks. A SRAM test vehicle manufactured in 28 nm technology with…”
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Journal Article -
4
Utilizing Acoustic Emission Signals to Evaluate BEoL Stack Damages of Two Different Sample Systems Caused by Cu-Pillar Shear-Off
Published in 2020 IEEE International Integrated Reliability Workshop (IIRW) (01-10-2020)“…In this work, a novel approach is introduced to identify and categorize damages occurring in the back end of line (BEoL) stack utilizing acoustic emission (AE)…”
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Conference Proceeding -
5
BEoL Stack Failure Mode Evaluation Utilizing Micromechanical Testing and FEM Modelling
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18-07-2022)“…In this work, the results of a mechanical BEoL (back end of line) stack failure mode evaluation study of a high-end microchip are presented. Deploying…”
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Conference Proceeding -
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Mechanical BEoL Robustness Evaluation Using Variable Loading Strategies and Acoustic Emission Damage Monitoring
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01-05-2023)“…On-chip interconnect stacks (Back End of Line, BEoL) in modern heterogeneous microelectronic products are exposed to various micromechanical loads. Each can…”
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Conference Proceeding -
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Mechanical BEoL Stability Investigation at Cu-Pillars under Cyclic Load
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15-09-2021)“…In this work, a method is introduced which enables the evaluation of the influence of cyclical mechanical stress on the back end of line (BEoL) stack by…”
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Conference Proceeding -
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BEoL Damage Evaluation Utilizing Sub-Critical Cu-Pillar Shear Tests, Acoustic Emission, nXCT, and SEM/FIB Analysis
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06-07-2021)“…In previous works, the resulting damages in the back end of line (BEoL) stack triggered by Copper pillar (Cu-pillar) shear-off events were evaluated and…”
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Conference Proceeding -
9
Crack Identification in BEoL Stacks Using Acoustic Emission Testing and Nano X-ray Computed Tomography
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20-07-2020)“…A novel approach is presented to evaluate the mechanical stability of back end of line (BEoL) stacks. A SRAM test vehicle manufactured in 28 nm technology with…”
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Conference Proceeding