Search Results - "Silberman, Joel"

Refine Results
  1. 1

    Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology by Xiaoxiong Gu, Silberman, Joel A., Young, Albert M., Jenkins, Keith A., Dang, Bing, Yong Liu, Xiaomin Duan, Gordin, Rachel, Shlafman, Shlomo, Goren, David

    “…Electrical loss and substrate noise coupling induced by through-silicon-vias (TSVs) in silicon-on-insulator (SOI) substrates is characterized in frequency and…”
    Get full text
    Journal Article
  2. 2

    A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias by Wordeman, M., Silberman, J., Maier, G., Scheuermann, M.

    “…3D integration (3DI) holds promise for improved performance of integrated systems by increasing interconnect bandwidth [1]. A processor stacked with cache…”
    Get full text
    Conference Proceeding
  3. 3
  4. 4
  5. 5
  6. 6
  7. 7
  8. 8

    Designing for a gigahertz [guTS integer processor] by Hofstee, H.P., Sang H. Dhong, Meltzer, D., Nowka, K.J., Silberman, J.A., Burns, J.I., Posluszny, S.D., Takahashi, O.

    Published in IEEE MICRO (01-05-1998)
    “…At the IEEE International Solid State Circuits Conference this February, the IBM Austin Research Laboratory presented an experimental 64-bit integer processor…”
    Get full text
    Journal Article
  9. 9
  10. 10
  11. 11
  12. 12
  13. 13

    (HgCd)Te–SiO2 interface structure by Wilson, J. A., Cotton, V. A., Silberman, Joel, Laser, D., Spicer, W. E., Morgen, P.

    “…Low‐temperature chemical vapor deposited (CVD) SiO2 has proven to be a very important material for use as a passivation on HgCdTe, principally because it…”
    Get full text
    Journal Article
  14. 14

    Power-conscious design of the Cell processor's synergistic processor element by Takahashi, O., Cottier, S., Dhong, S.H., Flachs, B., Silberman, J.

    Published in IEEE MICRO (01-09-2005)
    “…The authors describe the low-power design of the synergistic processor element (SPE) of the cell processor developed by Sony, Toshiba and IBM. CMOS static…”
    Get full text
    Journal Article
  15. 15

    Low-power design approach of 11FO4 256-Kbyte embedded SRAM for the synergistic processor element of a Cell processor by Asano, T., Silberman, J., Dhong, S.H., Takahashi, O., White, M., Cottier, S., Nakazato, T., Kawasumi, A., Yoshihara, H.

    Published in IEEE MICRO (01-09-2005)
    “…The synergistic processor element is a new architecture oriented for multimedia and streaming processing. In this architecture, the memory is not a cache but a…”
    Get full text
    Journal Article
  16. 16

    A 4.8GHz fully pipelined embedded SRAM in the streaming processor of a CELL processor by Dhong, S.H., Takahashi, O., White, M., Asano, T., Nakazato, T., Silberman, J., Kawasumi, A., Yoshihara, H.

    “…A 6-stage fully pipelined embedded SRAM is implemented in a 90nm SOI technology. The array uses a conventional 6-transistor memory cell and sense amplifier to…”
    Get full text
    Conference Proceeding
  17. 17

    A 1.0-GHz single-issue 64-bit powerPC integer processor by Silberman, J., Aoki, N., Boerstler, D., Burns, J.L., Sang Dhong, Essbaum, A., Ghoshal, U., Heidel, D., Hofstee, P., Kyung Tek Lee, Meltzer, D., Hung Ngo, Nowka, K., Posluszny, S., Takahashi, O., Vo, I., Zoric, B.

    Published in IEEE journal of solid-state circuits (01-11-1998)
    “…The organization and circuit design of a 1.0 GHz integer processor built in 0.25 /spl mu/m CMOS technology are presented, a microarchitecture emphasizing…”
    Get full text
    Journal Article
  18. 18

    Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts by Xiaoxiong Gu, Silberman, J., Yong Liu, Xiaomin Duan

    “…Substrate noise coupling induced by Through Silicon Vias in SOI substrates is modeled and analyzed in frequency- and time-domain. In addition to a buried oxide…”
    Get full text
    Conference Proceeding
  19. 19

    3D integration ESD protection design and analysis by Mitra, Souvick, Gebreselasie, Ephrem, You Li, Gauthier, Robert, Silberman, Joel, Tyberg, Christy, Sakuma, Katsuyuki, Thuy Tran-Quinn, Ramachandran, Koushik, Angyal, Matthew

    “…A Design of Experiments (DOEs) matrix was created to evaluate probability of fails during a complex 3D integration process as a function of ESD protection…”
    Get full text
    Conference Proceeding
  20. 20

    A shorted global clock design for multi-GHz 3D stacked chips by Liang-Teck Pang, Restle, P. J., Wordeman, M. R., Silberman, J. A., Franch, R. L., Maier, G. W.

    Published in 2012 Symposium on VLSI Circuits (VLSIC) (01-06-2012)
    “…A global clock distribution technique for 3D stacked chips where the clock tree and grid are shorted between strata is presented and compared with a DLL-based…”
    Get full text
    Conference Proceeding