Search Results - "Silberman, Joel"
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1
Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-11-2013)“…Electrical loss and substrate noise coupling induced by through-silicon-vias (TSVs) in silicon-on-insulator (SOI) substrates is characterized in frequency and…”
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Journal Article -
2
A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias
Published in 2012 IEEE International Solid-State Circuits Conference (01-02-2012)“…3D integration (3DI) holds promise for improved performance of integrated systems by increasing interconnect bandwidth [1]. A processor stacked with cache…”
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Conference Proceeding -
3
Efficient AI System Design With Cross-Layer Approximate Computing
Published in Proceedings of the IEEE (01-12-2020)“…Advances in deep neural networks (DNNs) and the availability of massive real-world data have enabled superhuman levels of accuracy on many AI tasks and ushered…”
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4
A 7-nm Four-Core Mixed-Precision AI Chip With 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware Throttling
Published in IEEE journal of solid-state circuits (01-01-2022)“…Reduced precision computation is a key enabling factor for energy-efficient acceleration of deep learning (DL) applications. This article presents a 7-nm…”
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Journal Article -
5
Power-Limited Inference Performance Optimization Using a Software-Assisted Peak Current Regulation Scheme in a 5-nm AI SoC
Published in IEEE journal of solid-state circuits (18-10-2024)“…Discrete AI inference cards, operating under form-factor and system-defined peak power constraints, must serve diverse inference requests with widely varying…”
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6
RaPiD: AI Accelerator for Ultra-low Precision Training and Inference
Published in 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA) (01-06-2021)“…The growing prevalence and computational demands of Artificial Intelligence (AI) workloads has led to widespread use of hardware accelerators in their…”
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Conference Proceeding -
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14.1 A Software-Assisted Peak Current Regulation Scheme to Improve Power-Limited Inference Performance in a 5nm AI SoC
Published in 2024 IEEE International Solid-State Circuits Conference (ISSCC) (18-02-2024)“…The rapid emergence of AI models, specifically large language models (LLMs) requiring large amounts of compute, drives the need for dedicated AI inference…”
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Conference Proceeding -
8
Designing for a gigahertz [guTS integer processor]
Published in IEEE MICRO (01-05-1998)“…At the IEEE International Solid State Circuits Conference this February, the IBM Austin Research Laboratory presented an experimental 64-bit integer processor…”
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Journal Article -
9
A Scalable Multi-TeraOPS Core for AI Training and Inference
Published in IEEE solid-state circuits letters (01-12-2018)“…This letter presents a multi-TOPS AI accelerator core for deep learning training and inference. With a programmable architecture and custom ISA, this engine…”
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10
9.1 A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13-02-2021)“…Low-precision computation is the key enabling factor to achieve high compute densities (TOPS/W and TOPS/mm 2 ) in AI hardware accelerators across cloud and…”
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Conference Proceeding -
11
A Scalable Multi- TeraOPS Deep Learning Processor Core for AI Trainina and Inference
Published in 2018 IEEE Symposium on VLSI Circuits (01-06-2018)“…A multi-TOPS AI core is presented for acceleration of deep learning training and inference in systems from edge devices to data centers. With a programmable…”
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Conference Proceeding -
12
A 3.0 TFLOPS 0.62V Scalable Processor Core for High Compute Utilization AI Training and Inference
Published in 2020 IEEE Symposium on VLSI Circuits (01-06-2020)“…A processor core is presented for AI training and inference products. Leading-edge compute efficiency is achieved for robust fp16 training via efficient…”
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Conference Proceeding -
13
(HgCd)Te–SiO2 interface structure
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-1983)“…Low‐temperature chemical vapor deposited (CVD) SiO2 has proven to be a very important material for use as a passivation on HgCdTe, principally because it…”
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Journal Article -
14
Power-conscious design of the Cell processor's synergistic processor element
Published in IEEE MICRO (01-09-2005)“…The authors describe the low-power design of the synergistic processor element (SPE) of the cell processor developed by Sony, Toshiba and IBM. CMOS static…”
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15
Low-power design approach of 11FO4 256-Kbyte embedded SRAM for the synergistic processor element of a Cell processor
Published in IEEE MICRO (01-09-2005)“…The synergistic processor element is a new architecture oriented for multimedia and streaming processing. In this architecture, the memory is not a cache but a…”
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Journal Article -
16
A 4.8GHz fully pipelined embedded SRAM in the streaming processor of a CELL processor
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)“…A 6-stage fully pipelined embedded SRAM is implemented in a 90nm SOI technology. The array uses a conventional 6-transistor memory cell and sense amplifier to…”
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Conference Proceeding -
17
A 1.0-GHz single-issue 64-bit powerPC integer processor
Published in IEEE journal of solid-state circuits (01-11-1998)“…The organization and circuit design of a 1.0 GHz integer processor built in 0.25 /spl mu/m CMOS technology are presented, a microarchitecture emphasizing…”
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Journal Article -
18
Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01-10-2012)“…Substrate noise coupling induced by Through Silicon Vias in SOI substrates is modeled and analyzed in frequency- and time-domain. In addition to a buried oxide…”
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Conference Proceeding -
19
3D integration ESD protection design and analysis
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01-09-2015)“…A Design of Experiments (DOEs) matrix was created to evaluate probability of fails during a complex 3D integration process as a function of ESD protection…”
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Conference Proceeding -
20
A shorted global clock design for multi-GHz 3D stacked chips
Published in 2012 Symposium on VLSI Circuits (VLSIC) (01-06-2012)“…A global clock distribution technique for 3D stacked chips where the clock tree and grid are shorted between strata is presented and compared with a DLL-based…”
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Conference Proceeding