Design and fabrication of compliant micromechanisms and structures with negative Poisson's ratio

This paper describes a new way to design and fabricate compliant micromechanisms and material structures with negative Poisson's ratio (NPR). The design of compliant mechanisms and material structures is accomplished in an automated way using a numerical topology optimization method, The proced...

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Bibliographic Details
Published in:	Journal of microelectromechanical systems Vol. 6; no. 2; pp. 99 - 106
Main Authors:	Larsen, U.D., Signund, O., Bouwsta, S.
Format:	Journal Article
Language:	English
Published:	New York, NY IEEE 01-06-1997 Institute of Electrical and Electronics Engineers
Subjects:	Applied sciences Exact sciences and technology Glass Mechanical engineering. Machine design Mechanical factors Optical device fabrication Optimization methods Plasma applications Plasma chemistry Precision engineering, watch making Silicon Sputter etching Testing Topology Reactive ion etching Gripper Poisson ratio Dry process Precision engineering Rapid prototyping Micromanipulation Miniaturization PECVD Chemical vapor deposition Production process
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Summary:	This paper describes a new way to design and fabricate compliant micromechanisms and material structures with negative Poisson's ratio (NPR). The design of compliant mechanisms and material structures is accomplished in an automated way using a numerical topology optimization method, The procedure allows the user to specify the elastic properties of materials or the mechanical advantages (MA's) or geometrical advantages (GA's) of compliant mechanisms and returns the optimal structures. The topologies obtained by the numerical procedure require practically no interaction by the engineer before they can be transferred to the fabrication unit. Fabrication is carried out by patterning a sputtered silicon on a plasma-enhanced chemical vapor deposition (PECVD) glass with a laser micromachining setup. Subsequently, the structures are etched into the underlying PECVD glass, and the glass is underetched, all in one two-step reactive ion etching (RIE) process. The components are tested using a probe placed on an x-y stage. This fast prototyping allows newly developed topologies to be fabricated and tested within the same day.
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23
ISSN:	1057-7157 1941-0158
DOI:	10.1109/84.585787