Search Results - "Siddabathula, M."

Excellent Reliability performances of a truly 5V nBOXFET for Automotive and IOT applications by Lipp, D., Zhao, Z., Krause, G., Arfaoui, W., Ebrard, E., Bossu, G., Evseev, S., Herklotz, M., Siddabathula, M.

“…In a Fully-Depleted Silicon-On-Insulator (FDSOI) high-k metal gate technology a new device type is evaluated for 5V applications. To support high voltages,…”
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Off-state TDDB in FinFET Technology and its Implication for Safe Operating Area by Toledano-Luque, M., Paliwoda, P., Nour, M., Kauerauf, T., Min, B., Bossu, G., Siddabathula, M., Nigam, T.

“…Standard CMOS reliability has been focused on digital applications and the user profiles associated with these products. However, emerging applications in…”
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A Novel HCI Reliability Model for RF/mmWave Applications in FDSOI Technology by Arfaoui, W., Bossu, G., Muhlhoff, A., Lipp, D., Manuwald, R., Chen, T., Nigam, T., Siddabathula, M.

“…Although technology scaling to deep submicron enable higher degrees of semiconductor integration, highly integrated circuit have become increasingly sensitive…”
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22FDX™ 5G 28GHz 20dBm Power Amplifier Constant Load and VSWR accelerated aging reliability by Bossu, G., Syed, S., Evseev, S., Jerome, J.A.S., Arfaoui, W., Lipp, D., Siddabathula, M.

“…Power Amplifier (PA) is a key component for embedded RF/mmWave on advanced CMOS technologies on the way to replace the III/V technologies. PA reliability has…”
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A Deeper Understanding of Well Charging Reliability with Circuit Relevant Test Structures by Tan, T. L., Eng, C. W., Xu, H., Soon, J. M., Ebard, E., Siddabathula, M., Phoong, B. F., Poh, K. H., Prabhu, M., Zhao, X. -L., Koo, J. M., Cho, K., Zhang, G.-W.

“…Antenna rules relating to well charging is becoming an important aspect to consider in design rule checks on the product apart from the conventional antenna to…”
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Alternating Temperature Stress and Deduction of Effective Stress Levels from Mission Profiles for Semiconductor Reliability by Hirler, A., Alsioufy, A., Biba, J., Lehndorff, T., Lipp, D., Lochner, H., Siddabathula, M., Simon, S., Sulima, T., Wiatr, M., Hansch, W.

“…Mission profiles and step-stress life tests are depending on cumulative damage models for reliability analysis. Although cumulative damage models exist, they…”
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Excellent 22FDX Hot-Carrier Reliability for PA Applications by Chen, T., Zhang, C., Arfaoui, W., Bellaouar, A., Embabi, S., Bossu, G., Siddabathula, M., Chew, K.W.J., Ong, S. N., Mantravadi, M., Barnett, K., Bordelon, J., Taylor, R., Janardhanan, S.

“…This work shows the excellent HCI (hot-carrier injection) reliability that 22FDX demonstrates for mmWave PA applications. The underlying device physics to…”
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