Search Results - "Shuying Ma"
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Theoretical Study on the Thermal Decomposition Mechanism of Fe(EDTA) - and Fe(EDTMP)
Published in Molecules (Basel, Switzerland) (13-09-2024)“…The decomposition mechanisms of Fe(EDTA) and Fe(EDTMP) complexes, widely used in various industrial applications, were investigated through a theoretical…”
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Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application
Published in Sensors (Basel, Switzerland) (22-07-2020)“…To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip…”
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3
Studies of the interaction between demeclocycline and human serum albumin by multi-spectroscopic and molecular docking methods
Published in Spectrochimica acta. Part A, Molecular and biomolecular spectroscopy (15-02-2013)“…[Display omitted] ► The interaction of demeclocycline and HSA was studied by multi-spectroscopic and molecular docking methods. ► The binding constants,…”
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4
Storm Time EMIC Waves Observed by Swarm and Van Allen Probe Satellites
Published in Journal of geophysical research. Space physics (01-01-2019)“…The temporal and spatial evolution of electromagnetic ion cyclotron (EMIC) waves during the magnetic storm of 21–29 June 2015 was investigated using…”
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5
Decomposition and Decoupling Analysis of Carbon Emissions in Xinjiang Energy Base, China
Published in Energies (Basel) (01-08-2022)“…China faces a difficult choice of maintaining socioeconomic development and carbon emissions mitigation. Analyzing the decoupling relationship between economic…”
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6
Gas-bearing prediction of deep reservoir based on DNN embeddings
Published in Frontiers in earth science (Lausanne) (19-04-2023)“…The extraction of gas-bearing information from the deeply underground reservoir is extremely difficult due to the weak seismic response and complicated gas…”
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Corrigendum: Gas-bearing prediction of deep reservoir based on DNN embeddings
Published in Frontiers in earth science (Lausanne) (19-05-2023)Get full text
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A two-branch neural network for gas-bearing prediction using latent space adaptation for data augmentation-An application for deep carbonate reservoirs
Published in IEEE geoscience and remote sensing letters (31-07-2024)“…Deep learning has been utilized for gas-bearing prediction in recent years due to its powerful nonlinear fitting capacity, however the scarcity of log labels…”
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Abnormal distribution of ionospheric electron density during November 2004 super-storm by 3D CT reconstructions from IGS and LEO/GPS observations
Published in Science China. Technological sciences (01-05-2012)“…Using time-dependent 3D tomography method, the electron density distributions in the low-latitude ionosphere during November 2004 super-storm are reconstructed…”
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10
Study on the behaviors of impurities in cadmium zinc telluride
Published in Journal of crystal growth (15-06-2007)“…Impurities in three cadmium zinc telluride (Cd 1− x Zn x Te or CZT) ingots grown by the modified vertical Bridgman (MVB) method were examined by using…”
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Computational studies on the binding mechanism between triazolone inhibitors and Chk1 by molecular docking and molecular dynamics
Published in Molecular bioSystems (01-01-2015)“…Chk1, a serine/threonine protein kinase that participates in transducing DNA damage signals, is an attractive target due to its involvement in tumor initiation…”
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Theoretical Study on the Thermal Decomposition Mechanism of Fe[sup.−]
Published in Molecules (Basel, Switzerland) (01-09-2024)“…The decomposition mechanisms of Fe(EDTA)[sup.−] and Fe(EDTMP)[sup.−] complexes, widely used in various industrial applications, were investigated through a…”
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Journal Article -
13
Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…The demand for miniaturized package size, higher performance and integration density, lower power consumption, and lower manufacturing cost drives the…”
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Conference Proceeding -
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Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies
Published in Microsystem technologies : sensors, actuators, systems integration (01-11-2021)“…3D WLCSP with via last TSV and UV laser releasable temporary bonding technologies is an ideal scheme to meet the increasing high performance, low cost and…”
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Predicting the ecotoxicity of ionic liquids towards Vibrio fischeri using genetic function approximation and least squares support vector machine
Published in Journal of hazardous materials (01-01-2015)“…•ILs are really not green solvents, and need to conduct the toxicity test.•GFA and LSSVM were used to predict the ecotoxicity of ILs towards Vibrio…”
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HCFU inhibits cervical cancer cells growth and metastasis by inactivating Wnt/β-catenin pathway
Published in Journal of cellular biochemistry (12-12-2017)“…1-hexylcarbamoyl-5-fluorouracil (HCFU), also known as carmofur, is an effective chemotherapeutic agent applied to several cancers. This study was aimed to…”
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17
Analysis of DC Characteristics in PDSOI pMOSFETs Under the Combined Effect of NBTI and TID
Published in IEEE transactions on nuclear science (01-05-2022)“…The influence of dc characteristics in partially depleted silicon on insulator (PDSOI) pMOSFETs under different negative bias temperature instability (NBTI)…”
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Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…In this paper, ultra-thin eSiFO packages with body thickness of 150 μm were presented and the reliability were comprehensively studied, with an emphasis on…”
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Conference Proceeding -
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Radiation-hardened silicon photonic passive devices on a 3 µm waveguide platform under gamma and proton irradiation
Published in Optics express (09-05-2022)“…Silicon photonics is considered to be an ideal solution as optical interconnect in radiation environments. Our previous study has demonstrated experimentally…”
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3D wafer level compression molding process development for image sensor package
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01-08-2017)“…For CMOS image sensors (CIS), automotive application is a very big market. However, it is quite difficult for the package especially WLCSP to pass the…”
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Conference Proceeding