Search Results - "Shoso Shingubara, Shoso Shingubara"
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Fabrication of highly sensitive QCM sensor using AAO nanoholes and its application in biosensing
Published in Sensors and actuators. B, Chemical (10-12-2018)“…[Display omitted] To detect biomolecules with low molecular weight by quartz crystal microbalance (QCM) method, it is necessary to improve its sensitivity…”
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Fabrication of Nanomaterials Using Porous Alumina Templates
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01-04-2003)“…Nanofabrication by self-organization methods has attracted much attention owing to the fact that it enables mass production without the use of expensive…”
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Bactericidal effect of nanostructures via lytic transglycosylases of Escherichia coli
Published in RSC advances (05-01-2022)“…Nanostructures exhibit a bactericidal effect owing to physical interaction with the bacterial cell envelope. Here, we aimed to identify the mechanism…”
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Adhesion and bactericidal properties of nanostructured surfaces dependent on bacterial motility
Published in RSC advances (04-02-2020)“…Different nanostructured surfaces have bactericidal properties that arise from the interaction between the bacteria and the nanostructured surface. In this…”
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5
Effect of additives on preparation of vertical holes in Si substrate using metal-assisted chemical etching
Published in Japanese Journal of Applied Physics (01-06-2019)“…The influence of a polyethylene glycol (PEG) additive on the morphology of 10 m diameter holes in a Si(001) substrate formed by metal-assisted chemical etching…”
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6
Ferromagnetic nano-conductive filament formed in Ni/TiO2/Pt resistive-switching memory
Published in Applied physics. A, Materials science & processing (01-02-2015)“…There is a question whether the conductive filament (CF) formed in the oxide layer of a resistive-switching random access memory is made of oxygen vacancies or…”
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Effect of a metal interlayer under Au catalyst for the preparation of microscale holes in Si substrate by metal-assisted chemical etching
Published in Japanese Journal of Applied Physics (01-02-2019)“…Vertical microscale holes in Si(100) substrate were formed using a wet chemical method, metal-assisted chemical etching (MacEtch), with patterned Au catalyst…”
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8
Cu₂ZnSnS₄ thin films and nanowires prepared by different single-step electrodeposition method in quaternary electrolyte
Published in Materials letters (01-08-2011)“…We investigated the effect of single-step electrodeposition methods for the fabrication of CZTS thin films as solar cell absorber layer. For deposition of CZTS…”
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Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Published in Electrochimica acta (30-06-2013)“…High aspect ratio through Si vias (φ 2μm, depth 30μm) have been filled completely by Cu electroplating using an electroless deposited Cu seed layer. The…”
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10
Detailed analysis of liposome adsorption and its rupture on the liquid-solid interface monitored by LSPR and QCM-D integrated sensor
Published in Sensing and Bio-Sensing Research (01-06-2021)“…Liposomes have been attracted attention, because liposomes can mimic the lipid bilayer membrane of cells. Scientists apply liposomes for drug delivery systems…”
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Threshold switching of a NbOx device prepared by DC reactive sputtering
Published in Japanese Journal of Applied Physics (01-06-2019)“…Threshold switching devices based on insulator-metal transition (IMT) are expected to overcome the reduction of sneak current and studies of their use for…”
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Highly sensitive quartz crystal microbalance based biosensor using Au dendrite structure
Published in Japanese Journal of Applied Physics (01-02-2018)“…A Au dendrite structure was obtained by only electroplating under a suitable potential. A blanch like nanostructure was formed along the crystal orientation…”
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Fabrication of nanocone arrays by two step metal assisted chemical etching method
Published in Microelectronic engineering (05-03-2016)“…This work develops a novel method for preparing a moth eye structure, which has a sub-wavelength periodical Si nanocone structure on Si(100) substrate, using…”
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Hf layer thickness dependence of resistive switching characteristics of Ti/Hf/HfO2/Au resistive random access memory device
Published in Japanese Journal of Applied Physics (01-06-2018)“…Resistive random access memory (ReRAM) devices with a HfO2 dielectric layer have been studied extensively owing to the good reproducibility of their SET/RESET…”
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15
Formation of MoS2 nanostructure arrays using anodic aluminum oxide template
Published in Micro and Nano Engineering (01-11-2020)“…MoS2 nanotubes were prepared using a combination of a sol-gel technique and an anodic aluminum oxide template. The Morphology, crystal structure and electrical…”
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Oxide thickness dependence of resistive switching characteristics for Ni/HfOx/Pt resistive random access memory device
Published in Japanese Journal of Applied Physics (01-06-2015)“…The switching process of the conductive filament formed in Ni/HfOx/Pt resistive random access memory (ReRAM) devices were studied. We evaluated the oxide…”
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Switching behavior of resistive change memory using oxide nanowires
Published in Japanese Journal of Applied Physics (01-06-2018)“…Resistive change random access memory (ReRAM), which is expected to be the next-generation nonvolatile memory, often has wide switching voltage distributions…”
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Adhesion and Bactericidal Properties of a Wettability-Controlled Artificial Nanostructure
Published in ACS applied nano materials (26-10-2018)“…The adhesion behavior and bactericidal properties of the nanostructured surface of Si nanopillar array, which mimicked a cicada wing surface, were evaluated…”
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Formation of 1D and 2D Gold Nanoparticle Arrays by Divalent DNA-Gold Nanoparticle Conjugates
Published in Small (Weinheim an der Bergstrasse, Germany) (06-08-2012)“…Divalent DNA–AuNP (gold nanoparticle) conjugates comprising two DNA strands at diametrically opposed positions are prepared. Highly linear 1D and tetragonal…”
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Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology
Published in Electrochimica acta (01-07-2011)“…► Conformal electroless barrier and seed layers were formed in high aspect ratio TSV. ► Au nanoparticles of 20 nm diameter were used as a catalyst. ► Adhesion…”
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