High density packaging techniques for miniaturization of satellite RF and microwave subsystems: Attachments, Interconnections and Hermetic sealing

High density packaging techniques for miniaturization of satellite RF and microwave subsystems: Attachments, Interconnections and Hermetic sealing

Electronics packaging is identified as the most critical step for the development of modules and subsystems operating at higher frequencies. The RF and microwave subsystems for space applications continuously go through miniaturization journey along with increasing frequency of operation and need fo...

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Bibliographic Details
Published in:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) pp. 357 - 362
Main Authors: Chippalkatti, Vinod S, Biradar, R C, Shivarudraswami, Y, Mathan, N
Format: Conference Proceeding
Language:English
Published: IEEE 07-12-2021
Subjects:
Aerospace electronics
Attachments
CTE
Electronic Packaging
Hermetic Sealing
Interconnections
Manufacturing
Materials reliability
Microwave technology
Miniaturization
Packaging
RF and Microwave subsystems
Satellites
Technological innovation
Temperature
Thermal stress
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Summary:Electronics packaging is identified as the most critical step for the development of modules and subsystems operating at higher frequencies. The RF and microwave subsystems for space applications continuously go through miniaturization journey along with increasing frequency of operation and need for manufacturability. The space domain brings additional stringent environmental requirements for the subsystems to be compliant to space qualification criteria. The high density, high frequency and high reliability packages are intended to provide excellent mechanical and electrical performance in harsh space environment. This paper provides focus on the design concepts, materials and processes that are classified into three main stages viz., attachments, interconnects, and hermetic sealing with an end objective of enhancing the thermal and high frequency performance of the subsystem. The paper additionally describes some of the high density RF and microwave subsystem packaging technologies used in current and future space applications.
DOI:10.1109/EPTC53413.2021.9663882