Search Results - "Shiqin Xiao"
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Formation of HfSiON/SiO2/Si-substrate gate stack with low leakage current for high-performance high-κ misfets
Published in IEEE transactions on electron devices (01-04-2006)Get full text
Journal Article -
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Formation of HfSiON/SiO2/Si-substrate gate stack with low leakage current for high-performance high-[kappa] MISFETs
Published in IEEE transactions on electron devices (01-04-2006)Get full text
Journal Article -
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Formation and evaluation of CeN thin films
Published in Thin solid films (01-04-1998)“…CeN x films are prepared by rf ion plating and analyzed by X-ray photoelectron spectroscopy (XPS). Ar/N 2 flow ratios are varied and Ar gas is found to play a…”
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Journal Article Conference Proceeding -
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Laser dicing for higher chip productivity
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2016)“…This paper describes increased chip productivity using a laser dicing technique called stealth dicing (SD), in which optimized aberration correction is…”
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Conference Proceeding -
5
Comparison of TiN deposition by rf magnetron sputtering and electron beam sustained arc ion plating
Published in Thin solid films (04-12-1998)“…TiN films were deposited both by electron beam (EB) sustained Ti arc ion plating and by reactive magnetron sputtering in nitrogen atmosphere. Although the…”
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Conference Proceeding Journal Article -
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1st quantitative failure-rate calculation for the actual large-scale SRAM using ultra-thin gate-dielectric with measured probability of the gate-current fluctuation and simulated circuit failure-rate
Published in 2007 IEEE Symposium on VLSI Technology (01-06-2007)“…We investigated the influence over intermittent SRAM failure by gate current, Ig, fluctuation for the first time. In this paper, we also describe the…”
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Conference Proceeding -
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Ti-capping technique as a breakthrough for achieving low threshold voltage, high mobility, and high reliability of pMOSFET with metal gate and high-k dielectrics technologies
Published in 2009 IEEE International Electron Devices Meeting (IEDM) (01-12-2009)“…We have proposed inhibition mechanism of common Al-capping technique for pMOSFET threshold-voltage (V th ) control for the first time, and have established…”
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Conference Proceeding -
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Formation of HfSiON/SiO/sub 2//Si-substrate gate stack with low leakage current for high-performance high-/spl kappa/ MISFETs
Published in IEEE transactions on electron devices (01-04-2006)“…The authors found the method to form HfSiON film with an ultrathin SiO/sub 2/ interfacial layer on the Si substrate by oxidizing the HfSiN. The HfSiN film was…”
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Journal Article -
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Formation of HfSiON/SiO sub(2)/Si-substrate gate stack with low leakage current for high-performance high- Kappa MISFETs
Published in IEEE transactions on electron devices (01-01-2006)“…The authors found the method to form HfSiON film with an ultrathin SiO sub(2) interfacial layer on the Si substrate by oxidizing the HfSiN. The HfSiN film was…”
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Journal Article