Search Results - "Shin, Dongkil"
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Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip
Published in Engineering fracture mechanics (01-01-2015)“…•The SCB was successfully modified to measure the adhesion of film adhesive.•The specimen was designed without attachment of any adherend.•Delamination was…”
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Journal Article -
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Effect of surface conditions on interfacial adhesion between PCB and EMC
Published in 2007 International Conference on Electronic Materials and Packaging (01-11-2007)“…Adhesion strength of PCB and EMC interface was investigated. Surface conditions of PCB such as the number of plasma treatment, delay time before EMC molding,…”
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Conference Proceeding
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Development of Reliability Verification System for Robust Package Design
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01-04-2007)“…To achieve design for reliability (DFR), a reliability verification system (RVS) was developed. Package level and board level reliabilities were predicted by…”
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Conference Proceeding -
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Development of multi stack package with high drop reliability by experimental and numerical methods
Published in 56th Electronic Components and Technology Conference 2006 (2006)“…Board level drop reliability of MSP (multi stack package) composed of a logic chipset package at bottom and an MCP (multi chip package) at top was…”
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Conference Proceeding -
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Characterization of Wire Bondability on Overhang Structured Chip in Multi Chip Package
Published in 2006 International Conference on Electronic Materials and Packaging (01-12-2006)“…Characteristics of wire bonding on the overhang structured chip were investigated in this study. During the wire bonding process, chip crack and bondability…”
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Conference Proceeding