Search Results - "Shimozaki, Toshitada"

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  1. 1

    Thermoelectric Properties of Silicon Carbide Sintered with Addition of Boron Carbide, Carbon, and Alumina by Ohba, Yasuhiro, Shimozaki, Toshitada, Era, Hidenori

    Published in MATERIALS TRANSACTIONS (01-06-2008)
    “…The thermoelectric properties were examined of SiC specimens prepared by mixing α-SiC powder with B4C, C, and Al2O3 and then sintering at 2100°C. Sintered…”
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    Journal Article
  2. 2

    Structure of Thermoelectric Material CoSb3 Formed by Reactive Diffusion by Shimozaki, Toshitada, Kim, Keun-soo, Iwata, Toshihiko, Okino, Takahisa, Lee, Chan-Gyu

    Published in MATERIALS TRANSACTIONS (2002)
    “…Thermoelectric material, CoSb3, has been formed in solid Co/solid Sb, solid Co/liquid Sb and solid Co/vapor Sb reactive diffusion couples in the temperature…”
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    Journal Article
  3. 3

    Reactive Diffusion between Ultra High Purity Iron and Silicon Wafer by Shimozaki, Toshitada, Hirai, Akira, Okino, Takahisa, Lee, Chan-Gyu

    Published in MATERIALS TRANSACTIONS (2001)
    “…Reactive diffusion between iron and silicon wafer has been studied by using 99.995% electrolytic iron flakes (4.5N–Fe), a 99.5% iron sheet (3N–Fe) and two…”
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    Journal Article
  4. 4

    Influence of Interdiffusion in Sn Solution on Growth of Cu sub(3)Sn and Cu sub(6)Sn sub(5) Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples by Shimozaki, Toshitada, Lee, Je-hyun, Lee, Chan-Gyu

    Published in Journal of phase equilibria and diffusion (01-02-2017)
    “…(ProQuest: ... denotes formulae and/or non-USASCII text omitted; see image).Reactive diffusion in the Cu-Sn binary system has been studied by using pure…”
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    Journal Article
  5. 5

    Influence of Interdiffusion in Sn Solution on Growth of Cu^sub 3^Sn and Cu^sub 6^Sn^sub 5^ Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples by Shimozaki, Toshitada, Lee, Je-hyun, Lee, Chan-gyu

    Published in Journal of phase equilibria and diffusion (01-02-2017)
    “…(ProQuest: ... denotes formulae and/or non-USASCII text omitted; see image) Reactive diffusion in the Cu-Sn binary system has been studied by using pure…”
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    Journal Article
  6. 6

    Influence of Interdiffusion in Sn Solution on Growth of Cu3Sn and Cu6Sn5 Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples by Shimozaki, Toshitada, Lee, Je-hyun, Lee, Chan-Gyu

    Published in Journal of phase equilibria and diffusion (01-02-2017)
    “…Reactive diffusion in the Cu-Sn binary system has been studied by using pure Cu / electrically plated Sn with 0.1-0.2 mm thicknesses diffusion couples…”
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    Journal Article
  7. 7

    Movement of Multiple Markers in Cu/Zn Multiple Phase Diffusion Couples and Its Numerical Analysis by Shimozaki, Toshitada, Lee, Je-hyun, Lee, Chan-Gyu

    Published in Journal of phase equilibria and diffusion (01-10-2016)
    “…Movement of multiple markers (M-Ms) embedded in the Cu end member of a Cu/Zn multiple phases diffusion couple (M-couple) has been experimentally investigated…”
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    Journal Article
  8. 8

    A New Finding About Conditions for More Than One Kirkendall Marker Plane in Binary Single Phase Diffusion Couples by Shimozaki, Toshitada, Lee, Je-hyun, Lee, Chan-Gyu

    Published in Journal of phase equilibria and diffusion (01-10-2016)
    “…It is now well known that there are experimental results of bifurcate, trifurcate or more Kirkendall marker planes (K-plane) in a multiple phase diffusion…”
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    Journal Article
  9. 9

    Beginning Time of Formation of New Phase in Fe-Zn Diffusion Couple during Non-isothermal Diffusion and Numerical Analysis for the Phase Growth Behavior by Shimozaki, Toshitada, Wakamatsu, Yoshinori, Onishi, Masami

    Published in ISIJ International (1993)
    “…A numerical analysis for phase growth behavior in Fe-Zn multi-phase diffusion couple during non-isothermal diffusion has been proposed by taking formation…”
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    Journal Article
  10. 10

    Steady state solutions of diffusion equations of self-interstitials and vacancies in silicon by OKINO, T, SHIMOZAKI, T, TAKAUE, R, ONISHI, M

    “…Self-interstitial and vacancy diffusion equations taking account of the sink and source of these point defects are analytically studied in the steady state,…”
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    Journal Article
  11. 11

    The effect of thickness and annealing condition on the microstructure and magnetic properties of Fe/Pt multilayer thin films by Nguyen, Dan Phuong, O, Se-Young, Park, Chan-Woo, Shin, Keesam, Lee, Chan-Gyu, Shimozaki, Toshitada, Okino, Takahisa

    “…[Fe(0.5 nm)/Pt(0.5 nm)] 40, [Fe(1 nm)/Pt(1.5 nm)] 20 and [Fe(3 nm)/Pt(3 nm)] 10 multilayer were prepared by DC magnetron sputtering. By conventional furnace…”
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    Journal Article
  12. 12

    Analysis of Diffusion Phenomena in Binary Vapor-Solid Couples by Onishi, Masami, Shimozaki, Toshitada

    “…Characteristics of the diffusion flux referred to the coordinate system fixed with respect to the solid surface of a vapor-solid diffusion couple have been…”
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    Journal Article
  13. 13

    Interdiffusivity and Ratio of Intrinsic Diffusivities in Ag–Cd Alloys by Shimozaki, Toshitada, Ito, Kenji, Onishi, Masami

    “…The interdiffusion coefficient and the ratio of the intrinsic diffusivities with respect to the mole fixed frame of reference in Ag–Cd alloys have been…”
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    Journal Article
  14. 14

    Usefulness of Intrinsic Diffusivities with Respect to Number of Mole Fixed Frame by Shimozaki, Toshitada, Onishi, Masami

    “…Consideration is given to the relationship between intrinsic diffusivities and self diffusivities in binary alloys. It is shown that this relation can be…”
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    Journal Article
  15. 15

    Interdiffusivity and Ratio of Intrinsic Diffusivities in Ag–Zn Alloys by Shimozaki, Toshitada, Ito, Kenji, Onishi, Masami

    “…Interdiffusion coefficients in Ag–Zn α phase in the temperature range between 823 and 1023 K have been determined by Sauer and Freise analysis using…”
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    Journal Article
  16. 16

    Interdiffusion Coefficient in Cu–Zn Alloys Determined by a Volatilization Phenomenon of Zinc by Shimozaki, Toshitada, Shuto, Hiroaki, Onishi, Masami

    “…Interdiffusion coefficients \ildeD in Cu–Zn alloys have been determined by using diffusion couples consisting of pure copper wire as vapor absorbent and the…”
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    Journal Article
  17. 17

    On Determination of Inter and Intrinsic Diffusion Coefficients in Binary System by Onishi, Masami, Wakamatsu, Yoshinori, Shimozaki, Toshitada

    “…The conceptions of various frames of reference for binary interdiffusion, which have been partly reported in the past, are summarized. The rational method of…”
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    Journal Article
  18. 18

    Determination of Ratios of Intrinsic Diffusivities in Ag–Cd and Ag–Zn Alloys by Vapor-Thin Plate Method by Shimozaki, Toshitada, Onishi, Masami, Ito, Kenji

    “…Ratios of the intrinsic diffusion coefficients relative to the number of mole fixed frame of reference in the α phase of Ag–Cd alloys at 1073 K and Ag–Zn…”
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    Journal Article
  19. 19

    Power generation characteristics of oxide thermoelectric modules incorporating nanostructured ZnO sintered materials by Souma, T., Ohtaki, M., Ohnishi, K., Shigeno, M., Ohba, Y., Shimozaki, T.

    “…A practical oxide thermoelectric module consisting of 12 pairs of p-NaCo 2 O 4 and nanostructured n-ZnO sintered materials was successfully fabricated by using…”
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    Conference Proceeding
  20. 20

    Thermal equilibrium concentrations and diffusivities of intrinsic point defects in silicon by Okino, Takahisa, Shimozaki, Toshitada

    Published in Physica. B, Condensed matter (15-12-1999)
    “…Recently, inherent defects in silicon crystal cause a serious problem resulting from the trend toward small scale and highly integrated circuits used in…”
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    Journal Article