Search Results - "Shigekawa, N."
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Effects of thermal annealing process on the electrical properties of p+-Si/n-SiC heterojunctions
Published in Applied physics letters (21-04-2014)“…The effects of thermal annealing process on the interface in p+-Si/n-SiC heterojunctions fabricated by using surface-activated bonding are investigated. It is…”
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2
Effects of interface state charges on the electrical properties of Si/SiC heterojunctions
Published in Applied physics letters (13-10-2014)“…Electrical properties of p−-Si/n−-SiC, p-Si/n−-SiC, p+-Si/n−-SiC, and n+-Si/n−-SiC heterojunctions fabricated by using surface-activated bonding are…”
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3
Thickness modulation and strain relaxation in strain-compensated InGaP/InGaP multiple-quantum-well structure grown by metalorganic molecular beam epitaxy on GaAs (100) substrate
Published in Journal of crystal growth (01-09-2016)“…We have investigated the structural features of a strain-compensated InGaP/InGaP multiple-quantum-well (MQW) structure on GaAs (100) substrate with a band-gap…”
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4
Small valence-band offset of In0.17Al0.83N/GaN heterostructure grown by metal-organic vapor phase epitaxy
Published in Applied physics letters (29-03-2010)“…The valence-band offset of a lattice-matched In0.17Al0.83N/GaN heterostructure grown by metal-organic vapor phase epitaxy (MOVPE) was investigated by x-ray…”
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5
Growth temperature dependent critical thickness for phase separation in thick (~1 μm) In Ga1−N (x=0.2–0.4)
Published in Journal of crystal growth (01-06-2015)Get full text
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6
Modulation of Characteristics of Si Solar Cells by Luminescence-Downshifting Zn-Based Nanoparticles with Mn doped
Published in 2020 47th IEEE Photovoltaic Specialists Conference (PVSC) (14-06-2020)“…We deposit Mn-doped Zn-based nanoparticles (NPs) on Si solar cells using the drop casting and layer-by-layer methods and measure their current-voltage and…”
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Conference Proceeding -
7
Effects of Layered Cadmium-Based Nanoparticles on Si Solar Cells
Published in 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) (01-06-2019)“…We deposit Cd-based nanoparticles on Si solar cells using the layer-by-layer method and measure their current-voltage and spectral response characteristics…”
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8
Thick (~1 μm) p-type InxGa1-xN (x ~ 0.36) grown by MOVPE at a low temperature (~570 °C)
Published in physica status solidi (b) (01-05-2015)“…This paper reports the post‐growth annealing effects of low‐temperature grown Mg‐doped InGaN. By using MOVPE, 1 μm‐thick Mg‐doped InxGa1–xN (x ~ 0.36) films…”
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9
Ultrahigh-speed InP/InGaAs DHPTs for OEMMICs
Published in IEEE transactions on microwave theory and techniques (01-10-2001)“…This paper presents an ultrahigh-speed InP/InGaAs double-heterostructure phototransistor (DHPT) with a record optical gain cutoff frequency of 82 GHz. This…”
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10
Surface Acoustic Waves in Reverse-Biased AlGaN/GaN Heterostructures
Published in IEEE transactions on electron devices (01-07-2008)“…Properties of surface acoustic waves (SAWs) in reverse-biased AlGaN/GaN heterostructures on (0001) sapphire substrates were studied by examining the…”
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11
SAW Filters Composed of Interdigital Schottky and Ohmic Contacts on AlGaN/GaN Heterostructures
Published in IEEE electron device letters (01-02-2007)“…We proposed surface acoustic wave (SAW) filters composed of interdigital Schottky and ohmic contacts on AlGaN/GaN heterostructures. The contribution of the…”
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12
A CAN-type MIC-PD ROSA operating at 40-Gbit/s
Published in 36th European Conference and Exhibition on Optical Communication (01-09-2010)“…We fabricated a 40-Gbit/s CAN-type ROSA using a maximized-induced-current photodiode (MIC-PD). 40-Gbit/s error-free operation was achieved for the first time…”
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Conference Proceeding -
13
Composite-field MIC-PDs for low-bias-voltage operation
Published in 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM) (01-05-2010)“…A novel maximized-induced-current-photodiode (MIC-PD) structure with a composite field depletion layer achieves high responsivity of 0.8 A/W and a wide 3-dB…”
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Conference Proceeding -
14
25-Gbit/s receiver optical subassembly using maximized-induced-current photodiode
Published in 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM) (01-05-2010)“…We fabricated 25-Gbit/s receiver optical subassemblies (ROSAs) using a maximized-induced-current photodiode (MIC-PD). By employing a high-speed and…”
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Conference Proceeding -
15
Electroluminescence of InAlAs/InGaAs HEMTs lattice-matched to InP substrates
Published in IEEE electron device letters (01-11-1995)“…Electroluminescence (EL) due to the electron-hole recombination in the channel of InAlAs/InGaAs HEMTs lattice-matched to InP substrates has been measured at…”
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16
Fabrication and Characterization of GaN/Diamond bonding interface
Published in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (05-10-2021)“…Direct bonding of diamond and GaN is successfully fabricated by surface activated bonding method. An 80% contact area of diamond and GaN is obtained. The…”
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Conference Proceeding -
17
Effects of Ar beam irradiation on Si-based Schottky contacts
Published in 2016 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) (01-06-2016)“…Effects of Ar beam irradiated during the surface-activated bonding process on n-Si and p-Si based Schottky barrier diodes (SBDs) were investigated by atomic…”
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Conference Proceeding -
18
Analysis of the influence of interface charges on the electrical characteristics of GaAs/GaN junctions
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01-05-2017)“…Electrical properties of p + -GaAs/n-GaN and n + -GaAs/n-GaN, heterojunctions fabricated by using surface-activated bonding (SAB) are investigated. The…”
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Conference Proceeding -
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High-energy and recombination-induced electroluminescence of InAlAs/InGaAs HEMT's lattice-matched to InP substrates
Published in IEEE transactions on electron devices (01-04-1997)“…We report room-temperature measurements of the high-energy electroluminescence (EL) of InAlAs/InGaAs HEMT's lattice-matched to InP substrates. We found that…”
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20
Electrical characteristics of SAB-based n+-n Ge/4H-SiC heterojunctions
Published in 2016 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) (01-06-2016)“…n + -Ge/n-4H-SiC heterojunctions were formed by surface activated bonding. The electrical characteristics of the heterojunctions were experimentally…”
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Conference Proceeding