Search Results - "Sherman, C.J."

Pulmonary haemorrhage and nephritis by Uys, C.J., Sherman, M., Price, S. & Philcox, D.

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Packaging of optoelectronics and passive optics for intrasystem interconnects by Grimes, G.J., Honea, W.K., Helton, J.S., Sherman, C.J., Sonnier, G.L.

“…Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high…”
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System level packaging of high density optoelectronic interconnections by Nyquist, J.S., Sherman, C.J., Grimes, G.J.

“…Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A…”
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Intrasystem interconnection in telecommunication platforms using plastic optical fiber by Grimes, G.J., Blyler, L.L., Sherman, C.J., Nyquist, J.S., Peck, S.R.

“…Large telecommunication switching and transmission platforms have massive interconnection requirements which are in the 1 Tb/s range and growing rapidly…”
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Optoelectronics for large scale optical backplanes by Grimes, G.J., Sonnier, G.L., Sherman, C.J., Honea, W.K., Helton, J.S.

“…Optical backplanes based on todays' technologies can offer important advantages to both manufacturers of telecommunications platforms and telecommunications…”
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Applications of parallel optical interconnects by Grimes, G.J., Wong, Y.M., Anthony, P.J., Priest, E., Sherman, C.J., Peck, S.R., Holland, W.R., Muehler, D.J., Faudskar, C.C., Nyquist, J.S., Helton, J.S., Honea, W.K., Bortolini, J.R., Gates, J.V., Sonnier, G.L., Markush, J.P.C.

“…The first phase of OETC (OETC-1) produced a parallel, 32-channel, high density (140 mm pitch), 500 Mb/s NRZ, point to point, optical data link. This link has a…”
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Photonic packaging using laser/receiver arrays and flexible optical circuits by Grimes, G.J., Markush, J.P.C., Yiu-Man Wong, Anthony, P.J., Holland, B., Priest, E.G., Sherman, C.J., Peck, S.R., Muehlner, D.J., Faudskar, C.C., Nyquist, J.S., Helton, J.S., Lepthian, C.A., Sonnier, G.L., Gates, J.V., Honea, W.K., Bortolini, J.R.

“…Optoelectronic modules and multifiber optical connectors were successfully applied to intrasystem interconnection within a large telecommunication transmission…”
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Packaging of optoelectronics and passive optics in a high capacity transmission terminal by Grimes, G.J., Sherman, C.J., Garvert, R.W., Peck, S.R., Honea, W.K., Helton, J.S., Jamison, W.W., Parzygnat, W.J., Bonanni, R., Nadler, R.J., Rausch, K.S., Thomas, J.J., Blyler, L.L.

“…We report on the first circuit board having passive optical circuits in combination with a backplane multifiber array connector. The approach uses four fused…”
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Photonic packaging using laser/receiver arrays and flexible optical circuits by Grimes, G.J., Markush, J.P.C., Wong, Y.M., Anthony, P.J., Holland, W.R., Priest, E.G., Sherman, C.J., Peck, S.R., Muehlner, D.J., Faudskar, C.C., Nyquist, J.S., Helton, J.S., Sonnier, G.L., Gates, J.V., Honea, W.K., Bortolini, J.R.

“…The topic of this paper is a description of how we replaced the discrete optoelectronic and passive optics devices of the optical interconnection system of a…”
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