Search Results - "Shell, Melissa"
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Exposing extreme ultraviolet lithography at Intel
Published in Microelectronic engineering (01-04-2006)“…In this paper we present the latest results on developing and integrating extreme ultraviolet lithography (EUVL) at Intel. The world’s first commercial EUV…”
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Journal Article Conference Proceeding -
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The bond shear test: an application for the reduction of common causes of gold ball bond process variation
Published in 30th Annual Proceedings Reliability Physics 1992 (1992)“…Examples indicate that the bond shear test can be used effectively to reduce common cause variability in the wire bond process, allowing in-process monitors to…”
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Conference Proceeding -
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Mechanical properties and adhesion measurements of films used in advanced packages
Published in Proceedings of 1994 IEEE International Reliability Physics Symposium (1994)“…"Depth-sensing" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three…”
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Conference Proceeding