Search Results - "Shang, J.K"

Synthesis of Single-Crystal TiO2 Nanowire Using Titanium Monoxide Powder by Thermal Evaporation by Shang, Z.G., Liu, Z.Q., Shang, P.J., Shang, J.K.

“…TiO 2 nanowires were synthesized successfully in a large quantity by thermal evaporation using titanium monoxide powder as precursor. X-ray diffraction results…”
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Effects of nitrogen doping on optical properties of TiO2 thin films by WU, P.-G, MA, C.-H, SHANG, J. K

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Effects of Zn addition on microstructure and tensile properties of Sn–1Ag–0.5Cu alloy by Song, H.Y., Zhu, Q.S., Wang, Z.G., Shang, J.K., Lu, M.

“…Effects of Zn addition on microstructure and tensile properties of Sn–1Ag–0.5Cu alloy were investigated. It was found that after the Zn addition, the Cu 6Sn 5…”
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Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current by Liu, H.Y., Zhu, Q.S., Wang, Z.G., Shang, J.K.

“…[Display omitted] ▶ Stress relaxation rate was increased after electromigration. ▶ Dominant mechanism of the stress relaxation was changed after…”
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Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu–Fe–P alloy by Cao, H., Min, J.Y., Wu, S.D., Xian, A.P., Shang, J.K.

“…Isothermal annealing was applied to an equal-channel angularly pressed (ECAP) Cu–Fe–P alloy to investigate the stability of the fine-grained microstructure…”
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Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect by Zhang, X.F., Guo, J.D., Shang, J.K.

“…Polarity effect on the interfacial reactions from high-density electric currents was investigated in a solder interconnect with a large disparity in the…”
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Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film by Zhu, Q.S., Zhang, Z.F., Wang, Z.G., Shang, J.K.

“…Electrodeposited Ag film was explored as a potential interfacial barrier to Bi segregation for suppressing the interfacial embrittlement of Cu/SnBi…”
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Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining by Zhang, X.F., Liu, H.Y., Guo, J.D., Shang, J.K.

“…Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction of…”
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Tunable Reactive Wetting of Sn on Microporous Cu Layer by Lai, Qingquan, Zhang, Lei, Chen, Cai, Shang, J.K.

“…Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure…”
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Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints by Wang, X.J., Zeng, Q.L., Zhu, Q.S., Wang, Z.G., Shang, J.K.

“…Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of…”
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Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern by Liu, Wei, Zhang, Lei, Hsia, K.J., Shang, J.K.

“…The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere （H2 5%＋Ar 95%）. Liquid solder spreading was observed to…”
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Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect by Liu, P.L, Shang, J.K

“…Bismuth-containing solder alloys have received much attention recently as potential alternatives to replace Pb-containing solder alloys in interconnects of…”
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Processing and mechanical properties of AlB2 flake reinforced Al-alloy composites by DEPPISCH, C, LIU, G, SHANG, J. K, ECONOMY, J

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Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates by SHANG, P. J, LIU, Z. Q, PANG, X. Y, LI, D. X, SHANG, J. K

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Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect by Zhang, X.F., Guo, J.D., Shang, J.K.

“…Interfacial reactions in a eutectic Sn–Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current…”
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In situ investigation on the oxidation behavior of a RESn 3 film by transmission electron microscopy by Li, C.F., Liu, Z.Q., Shang, P.J., Shang, J.K.

“…An in situ ex-environmental transmission electron microscopy (TEM) study was carried out to investigate the oxidation behavior of RESn 3 (RE = Nd, La, Ce) film…”
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Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints by Shang, P.J., Liu, Z.Q., Li, D.X., Shang, J.K.

“…Transmission electron microscopy evidence was obtained to elucidate the mechanism for Bi-induced interfacial void formation in solder joints. After thermal…”
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A promising sol–gel route to suppress pyrochlore phase during the synthesis of multiferroic Pb(Fe 2/3W 1/3)O 3 using inorganic salts by Yao, C.F., Liu, Z.Q., Shang, J.K.

“…This paper reports a promising route to synthesize multiferroic Pb(Fe 2/3W 1/3)O 3 by sol–gel method with inorganic salts of (CH 3COO) 2Pb·H 2O, Fe(NO 3) 3·9H…”
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Enhanced fatigue crack growth resistance at elevated temperature in TiC/Ti-6Al-4V composite : microcrack-induced crack closure by LIU, G, ZHU, D, SHANG, J. K

“…The fatigue crack growth behavior of TiC/Ti-6Al-4V alloy composite was examined at 450 deg C and compared to the room-temperature behavior. Contrary to the…”
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Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints by Zhang, L., Wang, Z.G., Shang, J.K.

“…Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing…”
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