Search Results - "Shafahian, Ehsan"

Chemical mechanical polishing for indium bond pad damascene processing by Ceulemans, Karl, Shafahian, Ehsan, Struyf, Herbert, Devriendt, Katia, Deckers, Steven, Heylen, Nancy, Derakhshandeh, Jaber

“…We investigated Chemical Mechanical Polishing (CMP) of indium, with the goal of obtaining indium bond pads for later cryo-3D integration of quantum…”
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Electrodeposition of bismuth telluride thin films containing silica nanoparticles for thermoelectric applications by Wu, Minxian, Ramírez, Salvador Alvarado, Shafahian, Ehsan, Guo, Lingyi, Glorieux, Christ, Binnemans, Koen, Fransaer, Jan

“…The electrodeposition of bismuth telluride (Bi2Te3) with incorporated silica nanoparticles (diameter = 16 nm) was studied in ethylene glycol using a rotating…”
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Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL by Hsia, Chih-Hao, Park, SungHo, Watanabe, Soichi, Arnold, Marco, El-Mekki, Zaid, Delande, Martine, Shafahian, Ehsan, Gowda, Punith K. M. K., Struyf, Herbert, Radisic, Aleksandar

“…We have successfully performed wafer-level (∅300 mm) fabrication of highly (111) oriented nanotwinned copper (nt-Cu) Redistribution layers (RDL) using…”
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Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications by Kang, Kumin, Derakhshandeh, Jaber, Wendeln, Christian, Schmidt, Ralf, Hao-Yu, Shafahian, Ehsan, El-Mekki, Zaid, Cochet, Tom, Maehara, Masataka, Beyne, Eric

“…This paper introduces a method for direct electrodeposition of indium on superconducting (SC) layers with an optimized electrolyte. Indium-to-indium bump and…”
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Fundamental study of IMC grains at low anneal temperature by Gerets, Carine, Derakhshandeh, Jaber, Shafahian, Ehsan, Cochet, Tom, Charles La Tulipe, Douglas, Beyer, Gerald, Miller, Andy, Beyne, Eric

“…IMC insertion bonding is a technique for low temperature and high throughput die to wafer stacking where a soft solder material like Sn is mechanically…”
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3D interconnects for quantum computing by Derakhshandeh, Jaber, Dangol, Anish, Hussain, Tassawar, Stegmann, Heiko, Vadiraj, A. M., Dhakras, Prathamesh, Witters, Thomas, Shafahian, Ehsan, M K, Punith Kumar, Gerets, Carine, Radisic, Aleksandar, Vaquilar, Aldrin, Goehnermeier, Aksel, Wan, Danny, Miller, Andy, Jourdain, Anne, Cherman, Vladimir, Beyer, Gerald, Beyne, Eric, De Greve, Kristiaan

“…In this paper, the development of 3D superconducting (SC) interconnects including SC microbumps, through silicon vias (TSVs) and pads on 300mm Si wafers for…”
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Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking by Derakhshandeh, Jaber, Beyne, Eric, Beyer, Gerald, Capuz, Giovanni, Cherman, Vladimir, De Preter, Inge, Gerets, Carine, Shafahian, Ehsan, Kennes, Koen, Jamieson, Geraldine, Cochet, Tom, Webers, Tomas, Tobback, Bert, Van der Plas, Geert, La Tulipe, Douglas Charles, Phommahaxay, Alain, Miller, Andy

“…In this paper, for first time, damascene process on thinned and bonded device wafer to a carrier using TBM layer is introduced. All the BS process steps…”
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Confined IMCs for low temperature and high throughput D2W bonding by Derakhshandeh, Jaber, La Tulipe, Douglas Charles, Capuz, Giovanni, Cherman, Vladimir, Gerets, Carine, Cochet, Tom, Shafahian, Ehsan, Preter, Inge De, Jamieson, Geraldine, Webers, Tomas, Beyne, Eric, Beyer, Gerald, Miller, Andy

“…In this paper an integration flow is introduced for IMC insertion bonding, enabling stacking microbumps with 10um and below pitches. Confined CoSn3 pre-IMC…”
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10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process by Derakhshandeh, Jaber, Capuz, Giovanni, Cherman, Vladimir, Inoue, Fumihiro, De Preter, Inge, Hou, Lin, Bex, Pieter, Gerets, Carine, Duval, Fabrice, Webers, Tomas, Bertheau, Julien, Van Huylenbroeck, Stefaan, Phommahaxay, Alain, Shafahian, Ehsan, Van der Plas, Geert, Beyne, Eric, Miller, Andy, Beyer, Gerald

“…In this paper, spacer bumps concept is introduced to increase the process window for TCB, lower the sensitivity of electrical yield to bump height variation,…”
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A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10\mu \mathrm pitch microbumps by Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy

“…In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to…”
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