Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface

One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shun...

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Bibliographic Details
Published in:	TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference pp. 1247 - 1250
Main Authors:	Spira, M.E., Kamber, D., Dormann, A., Cohen, A., Bartic, C., Borghs, G., Langedijk, J.P.M., Yitzchaik, S., Shabthai, K., Shappir, J.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-06-2007
Subjects:	adhesion to substrate Adhesives Assembly systems Biomembranes Couplings Cultured neurons Electric resistance Extracellular Neuro-Electronic hybrids Neurons Plasma devices Seal resistance Signal generators Surface resistance
Online Access:	Get full text
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Summary:	One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.
ISBN:	9781424408412 1424408415
ISSN:	2159-547X
DOI:	10.1109/SENSOR.2007.4300363