Search Results - "Seongil O"
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Hardware Architecture and Software Stack for PIM Based on Commercial DRAM Technology : Industrial Product
Published in 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA) (01-06-2021)“…Emerging applications such as deep neural network demand high off-chip memory bandwidth. However, under stringent physical constraints of chip packages and…”
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Conference Proceeding -
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25.4 A 20nm 6GB Function-In-Memory DRAM, Based on HBM2 with a 1.2TFLOPS Programmable Computing Unit Using Bank-Level Parallelism, for Machine Learning Applications
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13-02-2021)“…In recent years, artificial intelligence (AI) technology has proliferated rapidly and widely into application areas such as speech recognition, health care,…”
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Conference Proceeding -
3
Achieving One Billion Key-Value Requests per Second on a Single Server
Published in IEEE MICRO (01-05-2016)“…Distributed in-memory key-value stores (KVSs) have become a critical data-serving layer in cloud computing and big data infrastructure. Unfortunately, KVSs…”
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Journal Article -
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Architecting to achieve a billion requests per second throughput on a single key-value store server platform
Published in 2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA) (13-06-2015)“…Distributed in-memory key-value stores (KVSs), such as memcached, have become a critical data serving layer in modern Internet-oriented datacenter…”
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Conference Proceeding -
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CiDRA: A cache-inspired DRAM resilience architecture
Published in 2015 IEEE 21st International Symposium on High Performance Computer Architecture (HPCA) (01-02-2015)“…Although aggressive technology scaling has allowed manufacturers to integrate Giga bits of cells into a cost-sensitive main memory DRAM device, these cells…”
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Conference Proceeding -
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A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exploiting Dynamic Voltage-Frequency Scaling and Offset-Calibrated Readout Sense Amplifiers in a Fourth Generation 10nm DRAM Process
Published in 2022 IEEE International Solid-State Circuits Conference (ISSCC) (20-02-2022)“…Mobile systems for 5G communications and emerging technologies, such as advanced driver assistance system (ADAS), augmented reality (AR), and artificial…”
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Conference Proceeding -
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CIDR: A Cache Inspired Area-Efficient DRAM Resilience Architecture against Permanent Faults
Published in IEEE computer architecture letters (01-01-2015)“…Faulty cells have become major problems in cost-sensitive main-memory DRAM devices. Conventional solutions to reduce device failure rates due to cells with…”
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Journal Article -
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Exploring energy-efficient DRAM array organizations
Published in 2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS) (01-08-2011)“…DRAM is widely used as main-memory storage in contemporary computer systems. As VLSI process technology advances, more transistors can be integrated in a…”
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Conference Proceeding -
9
Defect Analysis and Cost-Effective Resilience Architecture for Future DRAM Devices
Published in 2017 IEEE International Symposium on High Performance Computer Architecture (HPCA) (01-02-2017)“…Technology scaling has continuously improved the density, performance, energy efficiency, and cost of DRAM-based main memory systems. Starting from sub-20nm…”
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Conference Proceeding -
10
Row-buffer decoupling: A case for low-latency DRAM microarchitecture
Published in 2014 ACM/IEEE 41st International Symposium on Computer Architecture (ISCA) (01-06-2014)“…Modern DRAM devices for the main memory are structured to have multiple banks to satisfy ever-increasing throughput, energy-efficiency, and capacity demands…”
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Conference Proceeding -
11
McSimA+: A manycore simulator with application-level+ simulation and detailed microarchitecture modeling
Published in 2013 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS) (01-04-2013)“…With their significant performance and energy advantages, emerging manycore processors have also brought new challenges to the architecture research community…”
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Conference Proceeding -
12
Microbank: architecting through-silicon interposer-based main memory systems
Published in Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis (16-11-2014)“…Through-Silicon Interposer (TSI) has recently been proposed to provide high memory bandwidth and improve energy efficiency of the main memory system. However,…”
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Conference Proceeding -
13
Multimodel ensemble forecasting of rainfall over East Asia: regularized regression approach
Published in International journal of climatology (30-11-2014)“…ABSTRACT This paper considers the problem of predicting the rainfall over East Asia from multimode outputs. For this purpose, we propose a new multimode…”
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Journal Article