Search Results - "Senowitz, C"

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding by Teh, W H, Deeb, C, Burggraf, J, Arazi, D, Young, R, Senowitz, C, Buxbaum, A

“…We report recent advances in tool and process hardening of a first of its kind 300 mm wafer-to-wafer (WtW) preprocessing, aligning, and bonding integrated…”
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Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology by Teh, W H, Deeb, C, Burggraf, J, Wimplinger, M, Matthias, T, Young, R, Senowitz, C, Buxbaum, A

“…We report on recent experimental studies performed as part of a 3D integrated circuit (3DIC) production-worthy process module roadmap check for 300 mm…”
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Integration of copper with low-k dielectrics for 0.13 /spl mu/m technology by Gambino, J., Stamper, A., McDevitt, T., McGahay, V., Luce, S., Pricer, T., Porth, B., Senowitz, C., Kontra, R., Gibson, M., Wildman, H., Piper, A., Benson, C., Standaert, T., Biolsi, P., Cooney, E.

“…The integration of Cu with low-k dielectrics poses a number of challenges. In this paper, we describe yield issues associated with integration of three…”
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