Search Results - "Seng-Hooi Ong"
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The novel flip chip ball grid array design and challenges to enable higher routing density and power requirement
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)“…Flip chip ball grid array (FCBGA) has been a common package technology to achieve higher input/output (IO) count. The call for more features have increase the…”
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Conference Proceeding
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Low cost flip chip package design concepts for high density I/O
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)“…The semiconductor industry at large is migrating from wire bond packaging to flip chip packaging due to electrical performance requirements. With the removal…”
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Conference Proceeding