Analysis of hygrothermal effects on mixed mode I/II interlaminar fracture toughness of carbon composites joints

Analysis of hygrothermal effects on mixed mode I/II interlaminar fracture toughness of carbon composites joints

Adhesive joints exhibit several advantages over conventional joints based on mechanical fasteners such as more uniform stress distribution, enhanced fatigue performance, stiffer connection, lower weight, smooth surface countor. However, the influence of environmental effects related to temperature a...

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Bibliographic Details
Published in:International journal of adhesion and adhesives Vol. 97; p. 102477
Main Authors: Sales, R.C.M., de Sousa, A.F., Brito, C.B.G., Sena, J.L.S., Silveira, N.N.A., Cândido, G.M., Donadon, M.V.
Format: Journal Article
Language:English
Published: Kidlington Elsevier Ltd 01-03-2020
Elsevier BV
Subjects:
Adhesive joints
Bonded joints
Carbon-epoxy composites
Delamination
Environmental effects
Environmental issues
Epoxides
Fasteners
Fractography
Fracture toughness
High temperature
Mechanical properties
Moisture absorption
Moisture content
Resin –based composites
Room temperature
Stress concentration
Stress distribution
Epoxides
Fractography
Resin –based composites
Environmental issues
Fracture toughness
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Summary:Adhesive joints exhibit several advantages over conventional joints based on mechanical fasteners such as more uniform stress distribution, enhanced fatigue performance, stiffer connection, lower weight, smooth surface countor. However, the influence of environmental effects related to temperature and moisture absorption on the mechanical performance of these types of composite joints are not yet fully understood. This work investigates the hygrothermal effects on fracture toughness of composite carbon/epoxy joints under Mixed Modes I/II loading in different mode ratios (35%, 50% and 75%). Joints were produced using co-curing (CC), co-bonding (CB) and secondary bonding (SB) technologies. The specimens were submitted to an elevated temperature wet condition (ETW) at a high moisture content (90% R.H.) and high temperature (80 °C) and compared with results obtained at a room temperature ambient (RTA). The SB samples under ETW condition exhibited higher GII/GT values when compared to CC and CB specimens tested under the same aging condition. Using the scanning electronic microscopy (SEM) technique, it was possible associate the delamination process behavior of aging specimens with the fracture toughness values. The wet and hot environment affect both adhesive and adherent what results in significant changes in the failure aspects during the delamination induced failure process.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2019.102477