Search Results - "Seit, Wenwei"
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Assembly Challenges and Approaches for 2.5D Chiplet Based System
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01-05-2023)“…In recent years, the semiconductor industry has seen a slow down in Moore's law and witnessed longer time spans between process technology nodes. In addition,…”
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Conference Proceeding -
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Development of 2.5D high density device on large ultra-thin active interposer
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01-12-2019)“…In the recent years, the industry is moving towards finer, higher density interconnections and better electrical performance from the die to the substrate. The…”
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Conference Proceeding