Search Results - "Se Woong Cha"

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  1. 1
    Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions

    Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions by Syed, A., Wei Lin, Eun-Sook Sohn, Se-Woong Cha

    “…Recent data [Syed, A., et al., "Alloying Effect of Ni, Co, and Sb in SAC solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish,"…”
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  2. 2
    Hysteresis and Anomaly in the Elastic Properties of the Shape Memory Alloy Ni0.507Ti0.493

    Hysteresis and Anomaly in the Elastic Properties of the Shape Memory Alloy Ni0.507Ti0.493 by Bak, Jino, Dae Kim, Mun, Koo Kim, Chul, Kaack, M., Pelzl, J., Woo Park, Young, Woong Cha, Se, Nahm, Kyun

    Published in Physica status solidi. A, Applied research (01-05-2002)
    “…We report a clear demonstration of thermal hysteresis and elastic anomaly in the elastic constant, CT, of a shape memory alloy Ni0.507Ti0.493. The observed…”
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  3. 3
    Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish

    Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish by Syed, A., Tae-Seong Kim, Se-Woong Cha, Scanlon, J., Chang-Gyun Ryu

    “…Recent industry data show that the drop/impact reliability of Chip Scale Packages has been detrimentally affected by switching to SAC alloys with Ag percent…”
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  4. 4
    Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

    Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions by Syed, A., Scanlan, J., Se Woong Cha, Won Joon Kang, Eun Sook Sohn, Tae Seong Kim, Chang Gyun Ryu

    “…This paper presents a collection of test data showing how the choice of package design and material can have a different effect on performance depending on the…”
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  5. 5
    Board level reliability assessments of package on package

    Board level reliability assessments of package on package by Hwang, Tae-Kyung, Sohn, Eun-Sook, Kang, Won-Joon, Cha, Se-Woong, Lee, Joon-Yeob, Hwang, Chan-Ha, Lee, Choon-Heung

    “…In spite of a great success of stacked package (PoP) in the market, some reliability issues about package on package (PoP) have been raised by several…”
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  6. 6
    Effect of mild aging on package drop performance for lead free solders

    Effect of mild aging on package drop performance for lead free solders by SeokHo Na, SeWoong Cha, WonJoon Kang, TaeSeong Kim, TaeKyung Hwang, JinYoung Khim

    Published in 2010 IEEE CPMT Symposium Japan (01-08-2010)
    “…There have been tremendous demands on portable electronic devices since last decade and board level drop performance has become one of the major concerns in…”
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